Multilayer Substrate Interconnect Using Flexible Wiring for Misalignment
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Solution Overview
Problem
Conventional substrate-to-substrate connectors face issues with misalignment and stress accumulation due to insufficient pins, leading to increased size and thickness when multiple connectors are used, and floating connectors have larger mounting areas and heights.
Innovation Solution
A multilayer electronic substrate design that includes a first and second substrate with direct connectors and a flexible wiring member to connect wires, allowing for relative movement and reducing stress, thereby eliminating the need for floating connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple substrate-to-substrate connectors are used to connect a large number of wires, then the number of connected wires is sufficient, but misalignment between connectors and substrates accumulates and stress is applied to the connectors
Solution Approach 1:
The connection system is divided into two distinct parts: rigid substrate-to-substrate connectors for high-speed signals and a flexible wiring member for other signals. This segmentation allows each component to optimize its function - the rigid connectors provide precise alignment for critical signals while the flexible member absorbs misalignment stresses and accommodates less critical connections
Solution Approach 2:
The flexible wiring member acts as an intermediary between the rigid connectors and the substrates. It mediates the mechanical stresses and misalignments by providing a compliant connection path, thereby protecting the rigid connectors from excessive stress while maintaining electrical connectivity
2Reliability
If a floating connector structure is used to absorb misalignment influences, then connector alignment reliability is improved, but the mounting area and height increase
Solution Approach 1:
Instead of making the entire connector structure floating and bulky, only specific portions are made flexible through the wiring member while the critical connector interfaces remain rigid and compact. This local application of flexibility achieves alignment tolerance without the penalty of increased overall size
Solution Approach 2:
The flexible wiring member functions as a thin, compliant interconnection that can bend and deform to accommodate misalignments. This flexible film approach provides the necessary mechanical compliance without requiring large mounting areas or increased height, unlike traditional floating connector structures
3Quantity of substance
If multiple connectors are used to connect all wires, then all wires can be connected, but the device size and thickness increase
Solution Approach 1:
Multiple connection functions are merged into a single integrated assembly where the rigid connectors and flexible wiring member work together as one unit. This merging eliminates the need for multiple separate floating connector assemblies, thereby reducing the overall thickness and size while maintaining the capability to connect all necessary wires
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the size and thickness of the multilayer electronic substrate by up to 40% and 70%, respectively, while ensuring reliable electrical connections despite misalignment and stress, without the need for floating connectors.
Implementation Method 1
a wiring member having flexibility, the wiring member having one end electrically connected to a second wire of the first substrate and another end electrically connected to a second wire of the second substrate
Data Source
AI summary
Provided is a multilayer electronic substrate that includes a first substrate, a second substrate placed on the first substrate such that surfaces of the first and second substrates face each other, a first connector mounted on the surface of the first substrate and electrically connected to a first wire of the first substrate, a second connector mounted on the surface of the second substrate and electrically connected to a first wire of the second substrate, the second connector being directly connected to the first connector, and a wiring member having flexibility, the wiring member having one end electrically connected to a second wire of the first substrate and another end electrically connected to a second wire of the second substrate, to electrically connect the second wire of the first substrate and the second wire of the second substrate.