Multilayer Substrate Openings for Gas Venting

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Solution Overview

Problem

Multilayer substrates with conductor patterns face issues of interlayer peeling due to residual gas, which can lead to bonding failures and conduction failures during the bonding process, especially when heating is involved, as gases produced during manufacturing are trapped and expand, causing delamination.

Innovation Solution

Incorporating strategically placed openings in the conductor patterns, both linear and circular, surrounded by conductors, to facilitate the escape of gases produced during manufacturing, thereby reducing the likelihood of interlayer peeling and ensuring effective degassing, which helps in preventing bonding failures and maintaining electrical integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductor pattern with large area is provided in the multilayer substrate, then electrical conduction is improved, but gas becomes trapped and interlayer peeling occurs during heating

Engineering Contradiction:

Improveelectrical conductionVSAvoidinterlayer peeling

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conductor pattern is segmented by providing openings (degassing holes) within it, dividing the continuous conductor into sections while maintaining electrical connectivity through alternative paths or vias. This segmentation allows gas to escape from beneath the conductor pattern during heating, preventing interlayer peeling while preserving electrical conduction function

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Openings are introduced as intermediary structures within the conductor pattern that serve as gas escape channels. These openings act as mediators between the trapped gas and the external environment, allowing gas to vent without compromising the overall structural integrity or electrical functionality of the conductor pattern

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If an opening is provided in the mounting electrode to allow gas escape, then interlayer peeling is reduced, but non-metal components in bonding material may remain in the opening and cause bonding failure

Engineering Contradiction:

Improveinterlayer peelingVSAvoidbonding strength

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The opening is strategically positioned within the conductor pattern away from the mounting electrode's bonding surface. This local differentiation allows the opening to serve its degassing function while the bonding region maintains its integrity and ability to form strong, reliable bonds without contamination from non-metal components

Inventive Principle:

Principle #3Local quality

3Strength

If heating is performed to bond components to the multilayer substrate, then bonding strength is improved, but residual gas expands and causes interlayer peeling

Engineering Contradiction:

Improvebonding strengthVSAvoidinterlayer peeling

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The openings are pre-provided in the conductor pattern before the bonding process. This preliminary action ensures that gas escape paths are already in place before heating begins, allowing gas to vent continuously during the bonding process without causing interlayer peeling, while still enabling the bonding to achieve sufficient strength

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of these openings significantly reduces interlayer peeling and bonding failures by allowing gases to escape, enhancing the bonding strength and electrical characteristics of the multilayer substrates while preventing the formation of voids and bursts during the bonding process.

Implementation Method 1

When the multilayer substrate is heated while such gas and water are left in the multilayer substrate, the gas (gas or vapor) expands

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

when a resin base material configuring a multilayer substrate receives heat of a predetermined temperature or higher, a portion of the resin base material is thermally decomposed and produces gas such as CO2

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 3

oxygen to be generated when an oxidized conductor pattern causes reduction reaction with heat and carbon in a thermoplastic resin undergo oxidation reaction, and produce CO2

Methodology Applied

Scientific EffectOxidation reaction: Oxidation

Data Source

PatentUS11064606B2Multilayer substrate and electric element

Publication Date: 2021.07.13 MURATA MFG CO LTD

AI summary

A multilayer substrate includes a stacked body including a plurality of insulating base material layers stacked on each other and a plurality of conductor patterns provided in contact with the plurality of insulating base material layers. The stacked body includes a first surface, and the plurality of conductor patterns include a plurality of mounting electrodes. The plurality of mounting electrodes include first openings. The first openings, in a plan view of a mounting surface, are provided over a mounting region and a non-mounting region of the mounting electrodes. The mounting region, when a mounted component is mounted, overlaps with the mounted component, and the non-mounting region does not overlap with the mounted component.