Multilayer Filter Circuit Substrate With Low-Inductance Ground Path
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Solution Overview
Problem
In multilayer substrates, the increased distance between a capacitor's mounting surface and the ground electrode generates an inductance component that hinders effective noise reduction in filter circuits, particularly at high frequencies.
Innovation Solution
A multilayer substrate design featuring an internal wire that extends from the capacitor's mounting surface to the ground electrode, electrically connected via conductors, reduces the inductance component by creating a smaller loop path and canceling mutual magnetic fluxes, thereby minimizing noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the distance between the mounting surface and the ground electrode is increased to accommodate other wires, then the wiring flexibility is improved, but the inductance component generated between the mounting surface and the ground electrode increases
Solution Approach 1:
The patent introduces an internal wire positioned between the mounting surface and the ground electrode, creating a three-dimensional wire arrangement. This internal wire provides an additional current path dimension that reduces the loop area without requiring increased vertical distance, thereby reducing inductance while maintaining wiring flexibility.
Solution Approach 2:
The internal wire acts as an intermediary element between the mounting surface and the ground electrode. It provides an intermediate current path that reduces the effective loop area, thereby reducing the inductance component generated between the mounting surface and the ground electrode while allowing other wires to be accommodated.
2Volume of stationary object
If the distance between the mounting surface and the ground electrode is increased, then more space is available for other components, but the noise reduction effect is degraded
Solution Approach 1:
By positioning the internal wire in the vertical dimension between the mounting surface and ground electrode, the patent reduces the horizontal loop area without compromising vertical spacing for component placement. This dimensional approach maintains available space while reducing the noise-generating loop area.
Solution Approach 2:
The patent converts the potentially harmful large loop area into a benefit by introducing the internal wire that creates a smaller effective current loop. The internal wire structure transforms the space between mounting surface and ground electrode from a noise-generating element into a noise-reducing feature.
3Ease of manufacture
If a conventional capacitor mounting structure is used, then the manufacturing process is simple, but the equivalent series inductance and mounting inductance cannot be effectively canceled
Solution Approach 1:
The patent merges the capacitor mounting structure with an integrated internal wire system that provides both mechanical support and electrical function. The internal wire is combined with the mounting substrate to form a unified structure that simultaneously provides mechanical support and minimizes inductance, maintaining manufacturing simplicity while improving performance.
Solution Approach 2:
The internal wire structure serves multiple functions: it provides mechanical support for the capacitor, establishes electrical connections, and reduces inductance by minimizing the current loop area. This multi-functional design maintains manufacturing simplicity while achieving superior noise filtering performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the inductance component between the capacitor and the ground electrode, enhancing noise reduction across a wider frequency band in filter circuits.
Implementation Method 1
the inductance component generated between the mounting surface on which the passive element is mounted and the ground electrode
Implementation Method 2
A technique for canceling the equivalent series inductance ESL of the capacitor by a negative inductance generated by magnetically coupling two coils
Data Source
AI summary
A multilayer substrate includes a multilayer body, an internal wire, land electrodes, and a ground electrode. The internal wire extends toward the land electrode from a position where the internal wire overlaps the land electrode when viewed from a first surface and is electrically connected to the land electrode by a via conductor. The internal wire is electrically connected to the ground electrode by a via conductor that is provided in a region from a position where a capacitor is located where the via conductor at least partially overlaps the land electrode when viewed from the first surface.