Multilayer Substrate Light-Shielding via Non-Wired Regions
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Solution Overview
Problem
In packageless image sensor structures, light from the rear surface of the image sensor can be imaged, leading to increased sensitivity issues and costs when attempting to shield this light with additional light-shielding members.
Innovation Solution
A multilayer substrate with conductive layers and vias connected in a straight line, incorporating a light-shielding portion in non-wired regions to prevent light from reaching the image sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a packageless structure is used to miniaturize and reduce weight, then device size and weight are reduced, but light from the rear surface of the image sensor can be imaged causing sensitivity issues
Solution Approach 1:
The light-shielding portion is integrated into the substrate structure itself, merging the light-shielding function with the substrate's wiring function. This eliminates the need for separate light-shielding members while maintaining both structural support and light blocking capabilities, thus reducing device size and weight while preventing rear surface light interference.
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides mechanical support, electrical wiring through conductive layers and vias, and light-shielding through strategically positioned non-wired regions. This multi-functionality allows the packageless structure to maintain compact size while effectively blocking harmful light from the rear surface of the image sensor.
2Object-affected harmful factors
If a light-shielding member is added to shield light from the rear surface of the image sensor, then light interference is reduced, but manufacturing cost increases
Solution Approach 1:
The light-shielding function is combined with the substrate manufacturing process itself. The light-shielding portions are formed as non-wired regions during the same multilayer substrate fabrication process that creates the wiring structure, eliminating the need for separate light-shielding components and reducing overall manufacturing cost.
Solution Approach 2:
The substrate structure itself provides the light-shielding function through its own design features (non-wired regions in non-wired regions), rather than requiring external light-shielding members. This self-service approach integrates light blocking capability into the fundamental substrate structure, simplifying manufacturing and reducing costs.
3Reliability
If non-wired regions are used to insulate signal wirings, then electrical insulation is achieved, but light transmission through these regions causes sensitivity problems
Solution Approach 1:
The substrate design creates local variations in structure: non-wired regions are positioned specifically in areas where light blocking is needed while maintaining electrical insulation functionality. The light-shielding portions are strategically located in non-wired regions to block light paths to the rear surface of the image sensor, while other areas maintain wiring continuity for electrical connections.
Solution Approach 2:
The non-wired regions serve as intermediary structures that simultaneously provide electrical insulation between conductive layers and light-shielding to the image sensor rear surface. By positioning light-shielding portions within these non-wired regions, the substrate uses the same structural feature for dual purposes: electrical isolation and optical protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively shields light transmitted through the substrate, reducing light incidence on the image sensor and potentially lowering costs by integrating light-shielding within the substrate structure.
Implementation Method 1
a light-shielding portion configured to shield light transmitted through a non-wired region insulating the vias and other wirings and traveling to the image sensor
Data Source
AI summary
A multilayer substrate on which an image sensor is mounted and which includes a plurality of conductive layers includes a plurality of vias (a drill via and a small-diameter via) piled and connected in a straight line; and a light-shielding portion configured to shield light transmitted through a non-wired region insulating the vias and other wirings and traveling to the image sensor. The light-shielding portion is a land of the via formed in a range broader than the non-wired region of another conductive layer in at least one conductive layer.