Multilayer Substrate Low Flow Member Coil Flatness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multilayer substrates with low flow members densely arranged around coil openings lead to reduced base material flow, causing excessive thickness and reduced flatness, which compromises electrical characteristics and reliability.
Innovation Solution
A multilayer substrate configuration with first and second low flow members, each with lower flowability than thermoplastic resin, strategically positioned on insulating base material layers to control base material flow into coil openings, maintaining coil shape and flatness while reducing variations in electrical characteristics and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If low flow members are densely arranged in the coil opening to prevent base material flow, then coil shape stability is improved, but the thickness of the coil opening portion becomes excessively large and flatness is reduced
Solution Approach 1:
The patent applies local quality by placing low flow members at specific strategic positions around the coil opening rather than densely filling the entire opening. This selective placement provides localized flow control where most needed while leaving other areas open to maintain overall flatness. The low flow members are positioned to control base material flow into the coil opening without causing excessive thickness buildup.
Solution Approach 2:
The patent uses partial action by implementing low flow members only in specific regions around the coil opening rather than throughout the entire opening area. This partial placement is sufficient to control base material flow and stabilize coil shape while avoiding the excessive flow restriction that would cause thickness problems and flatness issues.
2Reliability
If low flow members are placed to control base material flow into coil opening, then movement and deformation of linear conductor are reduced, but flow of base material is excessively reduced
Solution Approach 1:
The patent applies local quality by positioning low flow members at specific strategic locations around the coil opening where base material flow needs control. This localized approach provides flow control precisely where needed to prevent conductor deformation while maintaining adequate overall base material flow for proper filling and avoiding excessive thickness.
Solution Approach 2:
The patent uses partial action by placing low flow members only in specific regions rather than throughout the entire coil opening. This partial placement is sufficient to control base material flow and prevent conductor movement while avoiding excessive flow restriction that would cause filling problems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively stabilizes the coil shape and electrical characteristics, maintaining flatness and reliability by controlling base material flow, and allows for simplified manufacturing due to shared material usage with linear conductors.
Implementation Method 1
a first low flow member and a second low flow member provided in contact with the stacked body and including a flowability lower than a flowability of the thermoplastic resin at a temperature during heating and pressurizing of the thermoplastic resin
Implementation Method 2
during heating and pressurizing of the thermoplastic resin
Data Source
AI summary
A multilayer substrate includes a stacked body including thermoplastic resin insulating base material layers, a coil, and a first low flow member and a second low flow member including a flowability lower than the flowability of the thermoplastic resin at a temperature during heating and pressurizing. The coil includes linear conductors that are each provided on the insulating base material layers and include a first region surrounded by the linear conductors when viewed in a stacking direction (Z-axis direction) of the insulating base material layers. The first low flow member including a planar or substantially planar shape and the second low flow member including a winding shape, when viewed in the Z-axis direction, are arranged in the first region. The first low flow member, when viewed in the Z-axis direction, at least partially overlaps a second region surrounded by the second low flow member.