Multilayer Substrate Noise Isolation for Power Conversion Devices
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Solution Overview
Problem
In power conversion devices that miniaturize by placing an inverter circuit, current detection circuit, and control circuit on a common multilayer substrate, noise interference from the inverter circuit can degrade the accuracy of current detection due to dense placement of printed wiring patterns.
Innovation Solution
The printed wiring patterns are arranged such that the transmission pattern for detection signals is positioned differently from the on-off fluctuation unit, preventing overlap and thus reducing noise interference, while maintaining device miniaturization by using a multilayer substrate for overlapping circuit patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inverter circuit, current detection circuit, and control circuit are placed on a common multilayer substrate to miniaturize the device, then the device size is reduced, but noise interference from the inverter circuit degrades the accuracy of current detection
Solution Approach 1:
The patent utilizes the vertical dimension of the multilayer substrate to separate noise-sensitive and noise-generating circuits. The current detection circuit is placed on a first substrate layer while the inverter circuit is placed on a second substrate layer, using layer stacking to achieve spatial separation in the vertical direction. This dimensional approach allows miniaturization while maintaining detection accuracy by preventing noise coupling between circuits.
Solution Approach 2:
The patent divides the device into functionally separated circuit blocks on different substrate layers. The current detection circuit is segmented and isolated on one layer, while the inverter circuit occupies another layer. This segmentation prevents noise interference from propagating between circuits while maintaining the compact integrated structure, resolving the contradiction between miniaturization and measurement precision.
2Area of stationary object
If printed wiring patterns are densely placed to achieve miniaturization, then the device size is reduced, but noise interference increases and degrades signal quality
Solution Approach 1:
The patent resolves the noise interference issue by moving the separation strategy into the vertical dimension through multilayer substrate architecture. Noisy wiring patterns for the inverter circuit are routed on one substrate layer while sensitive detection signal wiring is routed on another layer, eliminating electromagnetic coupling even when patterns are densely placed within each layer. This maintains high area utilization while preventing noise interference.
Data Source
AI summary
A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.