Multilayer Substrate Power Conversion Device Noise Reduction
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Solution Overview
Problem
Existing power conversion devices using single-layer substrates with overlapping power supply and ground patterns form loops that act as antennas, leading to emission noise due to electromagnetic interference from inverter switching.
Innovation Solution
A multilayer substrate configuration is employed, where the power supply and ground patterns are formed in different layers and partially overlap, reducing the loop size and antenna function, thereby minimizing emission noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power supply and ground patterns are formed on a single layer substrate, then wiring simplicity is maintained, but emission noise increases due to large loop areas acting as antennas
Solution Approach 1:
The patent transitions from a single-layer substrate to a multilayer substrate structure, moving the power supply and ground patterns from the same plane to different layers. This dimensional change allows the patterns to overlap vertically, reducing the horizontal loop area and thereby minimizing electromagnetic radiation while maintaining wiring connectivity.
2Object-generated harmful factors
If power supply and ground patterns are separated to reduce noise, then emission noise decreases, but wiring complexity and loop area increase
Solution Approach 1:
By utilizing the vertical dimension through multilayer substrate construction, the power supply and ground patterns can overlap in the vertical direction while remaining electrically separated. This reduces the horizontal loop area to the minimum necessary for connection, effectively minimizing the antenna effect and electromagnetic radiation.
3Reliability
If impedance is reduced through wiring design, then power transmission efficiency improves, but emission noise may increase due to larger wiring loops
Solution Approach 1:
The multilayer substrate enables the power supply and ground patterns to be positioned close to each other in the vertical direction, reducing loop area and impedance simultaneously. The overlapping configuration minimizes the horizontal distance between return paths, achieving both low impedance for efficient power transmission and small loop area for noise reduction.
Data Source
AI summary
A power conversion device comprises a power conversion circuit, and a multilayer substrate that includes the power conversion circuit, and has a wiring pattern. The wiring pattern of the multilayer substrate includes a power supply pattern, and a ground pattern. The multilayer substrate includes a first layer and a second layer. The power supply pattern includes a first layer power supply pattern portion in the first layer. The ground pattern includes a second layer ground pattern portion in the second layer. The first layer power supply pattern portion and the second layer ground pattern portion overlap with each other at least in part in a direction perpendicular to a plate surface of the multilayer substrate.