Multilayer Substrate with Recessed Region and Embedded Tall Components
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Solution Overview
Problem
Multilayer substrates with rigid and flexible regions face issues where stress from deformation causes components to detach and become damaged, especially for components with large planar shapes.
Innovation Solution
A multilayer substrate design featuring a substrate body with a recessed region surrounded by a thicker second region, where tall components are embedded on both sides of the mounting surface for short components, providing increased rigidity and reducing stress application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid regions are made harder to prevent deformation, then structural stability is improved, but stress concentration increases causing components to detach or damage
Solution Approach 1:
The patent applies local quality by creating different regional characteristics within the substrate. The first region has a recessed structure with reduced thickness, making it more flexible, while the second region maintains normal thickness and provides rigidity. This local differentiation allows each region to have optimized mechanical properties suitable for its functional requirements, preventing stress concentration while maintaining overall structural stability.
Solution Approach 2:
The substrate is segmented into multiple regions with different mechanical properties. By dividing the substrate body into a first region (recessed, flexible) and a second region (non-recessed, rigid), the patent creates a composite structure that combines the advantages of both flexibility and rigidity, preventing uniform stress distribution and component damage.
2Adaptability or versatility
If flexible regions are made softer to allow deformation, then adaptability is improved, but component detachment increases due to stress
Solution Approach 1:
The patent creates local quality differences by forming a recess in the first region, making it more flexible for adaptation, while the second region remains rigid to provide stable mounting surfaces for components. This ensures components are located in regions with reliable attachment properties while the overall substrate maintains flexibility.
Solution Approach 2:
The recessed structure acts as an intermediary element between the flexible and rigid requirements. By creating a depth difference in the substrate, it provides a transition zone that allows the substrate to flex without transmitting excessive stress to component mounting areas, thus protecting component attachment reliability.
3Ease of manufacture
If uniform thickness is maintained across the substrate, then manufacturing simplicity is improved, but stress distribution becomes uneven causing component damage
Solution Approach 1:
The substrate is segmented into regions of different thicknesses. The first region has a recess creating reduced thickness, while the second region maintains full thickness. This segmentation allows stress to be distributed unevenly in a controlled manner, with the thinner first region absorbing flexural stress and the thicker second region providing stable support for components.
Solution Approach 2:
The patent changes the thickness parameter of the substrate in different regions. By controlling the depth of the recess in the first region while keeping the second region at nominal thickness, the patent optimizes stress distribution characteristics without completely redesigning the manufacturing process, as the recess can be formed using standard PCB fabrication techniques.
Data Source
AI summary
A multilayer substrate includes a substrate body defined by a laminate of flexible insulating base materials, a short component, and tall components. The substrate body includes a first region and a second region. The first region is surrounded by the second region in plan view, and is shorter than the second region. The short component is mounted on a bottom surface of a recess defined by the first region and the second region. The tall components are embedded in the second region of the substrate body and are disposed at positions including the position of a mounting surface for the short component in the height direction of the substrate body and on both sides of the first region when the substrate body is viewed in plan.