Multilayer substrate, method for manufacturing multilayer substrate, and electronic device
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Solution Overview
Problem
Existing multilayer substrates experience failures at connections between inter-layer connection conductors and metal foil layers, leading to unreliable electrical connections and noise interference in high-frequency signal transmission.
Innovation Solution
A multilayer substrate design featuring laminated insulating layers with conductive layers and metal foil layers of different compositions, where the conductive layers have the same composition as the inter-layer connection conductors and overlap them, ensuring reliable electrical connections and noise reduction through the use of thermoplastic resin and specific metal powders like SnAgCu, and the metal foil layers are electrically connected to the conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multilayer substrate connections are used, then manufacturing is simpler, but connection reliability deteriorates due to failures at inter-layer connections
Solution Approach 1:
A conductive layer is introduced as an intermediary between the inter-layer connection conductor and the metal foil layer. This conductive layer serves as a mediator that ensures reliable electrical connection by preventing direct contact issues between dissimilar materials, thereby resolving the contradiction between connection reliability and structural simplicity
Solution Approach 2:
The patent employs composite material structure where the conductive layer is formed by a mixture of metal powder and thermoplastic resin. This composite approach enhances connection reliability by combining the electrical conductivity of metal particles with the bonding and insulation properties of the thermoplastic matrix, creating a more robust connection interface
2Object-affected harmful factors
If conventional metal foil layer connections are used, then manufacturing process is simpler, but noise interference increases in high-frequency signal transmission
Solution Approach 1:
The conductive layer acts as an intermediary shielding layer between signal transmission paths and metal foil layers. This intermediate structure reduces electromagnetic noise and interference in high-frequency signals while maintaining manufacturing simplicity by integrating the shielding function into the existing lamination process
Solution Approach 2:
The patent changes the physical and electrical parameters of the connection structure by using a composite conductive layer with specific metal powder content and distribution. This parameter modification improves noise shielding performance by optimizing the electrical properties and spatial arrangement of conductive elements without complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces failures at inter-layer connections and noise interference, enhancing the reliability and performance of high-frequency signal transmission by ensuring robust electrical connections and effective noise shielding.
Implementation Method 1
a first conductive layer that is in contact with the first main surface of the first insulating layer, and in contact with the first inter-layer connection conductor and the second inter-layer connection conductor
Implementation Method 2
at least one first metal foil layer that is in contact with the third main surface of the first conductive layer, the at least one first metal foil layer overlapping the first inter-layer connection conductor and the second inter-layer connection conductor when viewed in the first direction
Data Source
AI summary
A first conductive layer is in contact with a first inter-layer connection conductor and a second inter-layer connection conductor. The first conductive layer has a same composition as the first and second inter-layer connection conductors. At least one first metal foil layer is in contact with a third main surface of the first conductive layer. The at least one first metal foil layer overlaps the first and second inter-layer connection conductors when viewed in a first direction. At least one second metal foil layer overlaps the first and second inter-layer connection conductors when viewed in the first direction, and is electrically connected to the first and second inter-layer connection conductors. The at least one second metal foil layer has a composition different from that of the first conductive layer.