Multilayer Substrate Resin Modulus for Conductor Connectivity
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Solution Overview
Problem
Existing multilayer substrates face connectivity issues between conductor patterns and interlayer connection conductors, particularly affecting high-frequency characteristics, due to degraded connectivity conditions during the lamination of insulator layers with various conductors.
Innovation Solution
A multilayer substrate design featuring a resin multilayer body with distinct thermoplastic resin layers, where the first interlayer connection conductor includes a resin and metallic elements, and the storage elastic modulus of the first thermoplastic resin layer is lower than that of the second layer at specific temperature ranges, ensuring enhanced connectivity between conductor patterns and interlayer connection conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple insulator layers with various conductors are laminated to form a composite transmission line, then signal transmission capability is improved, but connectivity between conductor patterns and interlayer connection conductors deteriorates
Solution Approach 1:
The patent controls the storage elastic modulus of the thermoplastic resin layer to be within a specific range (10^8 to 10^10 dyne/cm² at room temperature) to optimize both connectivity and signal transmission. By adjusting material parameters within defined boundaries, the invention resolves the contradiction between maintaining good conductor connectivity and enabling multi-layer signal transmission.
2Stability of the object's composition
If the storage elastic modulus of the thermoplastic resin layer is increased to improve structural stability, then layer adhesion improves, but connectivity between conductor patterns and interlayer connection conductors deteriorates
Solution Approach 1:
The patent identifies a specific range for the storage elastic modulus (10^8 to 10^10 dyne/cm²) that simultaneously provides adequate structural stability and maintains good connectivity between conductors. This parameter optimization resolves the contradiction by finding the optimal balance point rather than maximizing a single property.
Solution Approach 2:
The patent applies different material properties to different regions: the thermoplastic resin layer has controlled elastic modulus for connectivity, while the overall laminated structure provides structural stability. This local differentiation of material properties allows each region to optimize its function without compromising the other.
3Productivity
If conductor patterns and interlayer connection conductors are connected through thermoplastic resin layers, then signal transmission between layers is enabled, but peeling occurs at the interfaces during lamination
Solution Approach 1:
By controlling the storage elastic modulus of the thermoplastic resin to be within 10^8 to 10^10 dyne/cm², the patent prevents peeling at interfaces while enabling signal transmission. The optimized modulus ensures the resin is soft enough to maintain good contact with conductors during lamination but stable enough to prevent peeling after bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves excellent connectivity between signal or power transmission conductor patterns and interlayer connection conductors, improving high-frequency characteristics and reducing peeling at interfaces, thereby enhancing the overall performance of the multilayer substrate.
Implementation Method 1
a storage elastic modulus of the first thermoplastic resin layer is lower than a storage elastic modulus of the second thermoplastic resin layer
Data Source
AI summary
A multilayer substrate includes a resin multilayer body including, in a lamination direction, first and second laminate portions respectively including first and second thermoplastic resin layers, and a first interlayer connection conductor extending through the first thermoplastic resin layer. A storage elastic modulus of the first thermoplastic resin layer is lower than that of the second thermoplastic resin layer at a measurement temperature equal to or higher than a minimum melting point among melting points of metallic elements included in the first interlayer connection conductors and equal to or lower than melting points of the first thermoplastic resin layer and the second thermoplastic resin layer.