Multi-layer Substrate Resin Via Anchor Effect Delamination

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Solution Overview

Problem

Multi-layer substrates face delamination issues due to weak adhesion forces at interfaces, particularly between metal and resin, leading to electrical conduction disruptions and reliability concerns during thermal processes.

Innovation Solution

The implementation of resin vias that penetrate through insulating material layers, covering both sides of conductor layers and forming an integrated structure with the third insulating layer, enhances adhesion forces through an anchor effect, thereby reducing delamination and maintaining electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductor layer and insulating material layer are stacked to form a multi-layer substrate, then electrical conduction and insulation functions are achieved, but delamination occurs at the interface due to weak adhesion force

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidadhesion force at interface

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies preliminary action by performing surface roughening treatment or forming an adhesion layer on the conductor layer surface before stacking the insulating material layer. This preparatory step enhances the adhesion force at the interface, preventing delamination during subsequent thermal processes and ensuring reliable electrical connections throughout the substrate's lifecycle.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs composite materials by using an adhesion layer composed of different material properties than the conductor layer. This intermediate layer creates a composite structure that bridges the metal and resin interfaces, significantly improving interfacial adhesion strength and preventing delamination while maintaining electrical conduction functionality.

Inventive Principle:

Principle #40Composite materials

2Strength

If roughening treatment or adhesion layer is applied to increase adhesion force, then adhesion between conductor and insulating layers is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improveadhesion force at interfaceVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent merges the adhesion enhancement function with the existing conductor layer formation process. By integrating surface roughening treatment or adhesion layer formation into the standard conductor layer manufacturing workflow, the solution improves interfacial adhesion without adding separate, complex manufacturing steps, thus maintaining process efficiency while enhancing reliability.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If delamination occurs at the interface, then moisture collection and swelling occur, but new delamination and electrical conduction disruption are caused

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmoisture collection and swelling

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies beforehand cushioning by strengthening the interfacial adhesion through surface roughening or adhesion layers before thermal and moisture exposure occurs. This preventive measure creates a robust interface that resists delamination under thermal stress and moisture exposure, eliminating the conditions that would lead to swelling and subsequent electrical conduction disruption.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively suppresses delamination occurrence and propagation, ensuring reliable electrical connections and improved adhesion between insulating and conductor layers, even under thermal stress.

Implementation Method 1

The insulating member covers an upper surface of the conductor layer exposed in the via hole and covers a lower surface of the conductor layer exposed in the via hole through the penetrating portion of the conductor layer

Methodology Applied

Scientific EffectMechanical interlocking:

Data Source

PatentUS11289403B2Multi-layer substrate and method for manufacturing multi-layer substrate

Publication Date: 2022.03.29 SHINKO ELECTRIC IND CO LTD

AI summary

A multi-layer substrate includes: a first insulating layer; a conductor layer that is provided on an upper surface of the first insulating layer and that has a penetrating portion; a second insulating layer that covers the conductor layer and that is stacked on the upper surface of the first insulating layer; a via hole that penetrates the second insulating layer from an upper surface of the second insulating layer to reach an inside of the first insulating layer and that includes the penetrating portion; and an insulating member with which the via hole is filled. The conductor layer has a portion exposed in the via hole, and the insulating member covers an upper surface and a lower surface of the conductor layer exposed in the via hole through the penetrating portion of the conductor layer.