Multilayer Substrate with Segmented Ground Electrode
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Solution Overview
Problem
In multilayer substrates, the bonding force between dielectric layers and conductor patterns is weaker due to their different materials, leading to potential cracking or delamination, especially when the conductor pattern covers a wide area.
Innovation Solution
The multilayer substrate design includes a first conductor pattern with openings, allowing dielectric layers to bond only through these openings, and a second conductor pattern opposing the first pattern entirely through dielectric layers, thereby strengthening the bonding force and preventing cracking or delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conductor pattern is disposed in a wide range of a dielectric layer, then the ground electrode coverage is improved, but the bonding force between dielectric layers and conductor pattern deteriorates
Solution Approach 1:
The first conductor pattern is divided into multiple segments by forming openings (through-holes) at specific positions. This segmentation allows the dielectric layers to be directly bonded at these locations, creating strong bonding points that compensate for the weak bonding in the continuous conductor pattern areas, thereby resolving the contradiction between wide coverage and bonding strength.
2Area of stationary object
If a conductor pattern is disposed in a wide range of a dielectric layer, then the ground electrode coverage is improved, but the reliability against cracking or delamination deteriorates
Solution Approach 1:
By segmenting the first conductor pattern through openings, the patent creates multiple bonding points where dielectric layers directly contact each other. These direct bonding points act as reinforcement zones that prevent crack propagation and delamination, thereby improving reliability while maintaining wide ground electrode coverage.
Solution Approach 2:
The openings are strategically positioned in advance to prevent potential cracking or delamination. By creating direct dielectric-to-dielectric bonding points before any damage can occur, the structure is pre-reinforced against future mechanical failures, embodying the beforehand cushioning principle.
3Ease of manufacture
If dielectric layers are bonded directly to conductor patterns, then the manufacturing process is simplified, but the bonding force deteriorates due to material differences
Solution Approach 1:
The patent segments the conductor pattern to create direct dielectric-to-dielectric bonding interfaces. This maintains manufacturing simplicity while significantly improving bonding strength at critical locations, as direct material bonding is stronger than bonding through different material interfaces.
Data Source
AI summary
The multilayer substrate includes: a plurality of dielectric layers stacked on one another; a first conductor pattern 20 which is disposed along a principal surface 12a of a dielectric layer 12 and which is electrically connected to a ground; and second conductor patterns 22 and 24 which are disposed along the principal surface of a dielectric layer and which are opposed to the first conductor pattern 20 only through the dielectric layers therebetween, the second conductor patterns 22 and 24 forming inductor elements. Only the dielectric layers that sandwich the first conductor pattern 20 therebetween are bonded to each other via openings 20a through 20h formed in the first conductor pattern 20. As viewed from the stacking direction, the second conductor patterns substantially entirely overlap a portion other than the openings 20a through 20h in the first conductor pattern 20.