Multilayer Substrate Through-Hole Bonding With Selective Conductive Particles
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Solution Overview
Problem
Existing methods for manufacturing multilayer substrates using anisotropic conductive films face challenges in achieving uniform conduction characteristics and high manufacturing costs due to randomly dispersed conductive particles, which do not always contribute to connections between semiconductor substrates.
Innovation Solution
The selective disposition of conductive particles in the insulating adhesive layer of anisotropic conductive films, ensuring they align with through holes between facing semiconductor substrates, allows for efficient connection and bonding without unnecessary particles, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If anisotropic conductive film with randomly dispersed conductive particles is used to connect through electrodes, then the manufacturing step is simplified, but the conduction characteristics become ununiform and manufacturing cost increases due to unnecessary conductive particles
Solution Approach 1:
The patent applies local quality by creating regions with different conductive particle densities. Specifically, the area between facing through electrodes has a higher density of conductive particles compared to other areas. This localized concentration ensures reliable electrical connection at critical points while reducing unnecessary particles elsewhere, thereby improving conduction uniformity and reducing cost.
2Ease of manufacture
If anisotropic conductive film with randomly dispersed conductive particles is used to connect through electrodes, then the manufacturing step is simplified, but the manufacturing cost increases due to unnecessary conductive particles
Solution Approach 1:
The patent implements local quality by varying the concentration of conductive particles in different regions of the adhesive layer. The region between facing through electrodes contains a higher concentration of conductive particles to ensure reliable connection, while other regions have lower concentration or no particles. This reduces waste of conductive particles and lowers manufacturing cost while maintaining connection reliability.
3Ease of manufacture
If through electrodes are connected using anisotropic conductive film, then the manufacturing step is simplified to some extent, but the conductive particles may not be sufficiently disposed between the facing through electrodes
Solution Approach 1:
The patent applies local quality by creating a non-uniform distribution of conductive particles within the adhesive layer. The particle density is increased in the specific region between facing through electrodes to ensure sufficient particles are present for reliable electrical connection. This localized enhancement maintains connection reliability while preserving the simplified manufacturing process.
Solution Approach 2:
The patent employs preliminary action by pre-positioning or pre-concentrating conductive particles in the adhesive layer at locations corresponding to through electrode positions before the bonding process. This preliminary arrangement ensures that when substrates are bonded, conductive particles are already in optimal positions to establish reliable electrical connections, eliminating the need for complex alignment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures stable conduction characteristics and significantly decreases manufacturing costs by minimizing unnecessary conductive particles and simplifying the manufacturing steps, enabling the production of multilayer substrates with improved connectivity and cost-effectiveness.
Implementation Method 1
conductive particles which are selectively disposed between the through holes, and through holes of the semiconductor substrates facing each other are connected using the anisotropic conductive film
Implementation Method 2
semiconductor substrates each having the through hole are bonded together by an insulating adhesive
Data Source
AI summary
Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.