Multilayer Substrate Lamination With Split-Side Via Build-Up
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Solution Overview
Problem
The manufacturing method for multilayer substrates in existing technologies leads to increased costs and risks of cracks due to the need for large manufacturing apparatuses and potential gaps between support bodies and metal foils, allowing chemical infiltration.
Innovation Solution
A method involving etching and stacking insulating layers with patterned metal layers, forming vias, and bonding insulating layers to prevent apparatus size increase and crack formation, using half etching to maintain metal layer thickness and improve adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are built into three-layer metal foils simultaneously on both surfaces of the support body, then interlayer coupling with plated vias and paste vias is achieved, but the manufacturing apparatus grows in size and cost increases
Solution Approach 1:
The manufacturing process is divided into separate operations: first building substrates into one surface of the support body, then flipping the support body and building substrates into the other surface. This segmentation allows the use of a single, compact manufacturing apparatus rather than requiring a large apparatus capable of simultaneous dual-sided processing, thus reducing equipment cost and complexity while maintaining the reliability of interlayer coupling with both plated vias and paste vias.
2Strength
If support body and three-layer metal foils are held in vacuum, then bonding is achieved, but gaps may occur allowing chemical infiltration and crack formation
Solution Approach 1:
A resin film is applied to the surface of the support body before bonding the three-layer metal foil. This preliminary action creates a protective layer that prevents gaps from forming between the support body and metal foil, thereby preventing chemical infiltration and crack formation while maintaining strong bonding. The resin film acts as a barrier that eliminates the harmful gaps before they can cause damage.
3Strength
If the second metal layer is made thick before forming patterned shape, then adhesion is improved, but the layer becomes difficult to etch into precise patterns
Solution Approach 1:
The second metal layer is formed with a thickness that is slightly greater than the final required pattern thickness. This partial excess allows the layer to maintain sufficient adhesion strength while still enabling precise pattern formation through controlled etching. The etching process removes the excessive portion to achieve the precise final pattern, combining the benefits of thick-layer adhesion with thin-layer precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents cost escalation and crack occurrence during manufacturing by maintaining apparatus size and ensuring robust bonding without requiring large equipment, enhancing the reliability of the multilayer substrate.
Implementation Method 1
applying filled plating to the first through hole to form a first via as a plated via
Implementation Method 2
filling the second through hole with a conductive paste to form a second via as a paste via
Implementation Method 3
separating the resin films in a plurality of layered bodies
Implementation Method 4
bonding the first insulating layer of one layered body and the second insulating layer of another layered body to each other
Implementation Method 5
curing the third insulating layer to thereby obtain the multilayer substrate
Data Source
AI summary
A layered body is manufactured by etching a first foil constituting a three-layer metal foil to form a first metal layer shaped like a pattern, stacking a first insulating layer so as to bury the first metal layer, forming a first via as a plated via, forming a second metal layer shaped like a pattern on the first insulating layer, stacking a second insulating layer so as to bury the second metal layer, removing a second foil and a third foil constituting the three-layer metal foil, stacking a third insulating layer and a resin film on the second insulating layer, and providing a second via as a paste via to the second insulating layer, and a multilayer substrate is obtained by stacking a plurality of layered bodies.