Multilayer Substrate Insulation Structure for Lower Thermal Resistance
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Solution Overview
Problem
In power source devices with redundant structures, when some power source lines stop operating, the remaining lines experience increased power and temperature issues, leading to potential reliability problems, especially in environments like the ocean or outer space where cooling is limited, and magnetic devices face inefficiencies in heat radiation due to high thermal resistance in multilayer substrates.
Innovation Solution
A multilayer substrate with conductors wired on multiple substrates, using an insulation material with ceramics particles of varying diameters to match conductor intervals, reducing thermal resistance by improving insulation and fluidity, and allowing efficient heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer substrate uses traditional insulation materials (glass fiber and thermosetting resin), then dielectric strength and bonding are ensured, but thermal resistance becomes high making heat radiation inefficient
Solution Approach 1:
The patent uses a composite insulation material consisting of thermosetting resin combined with ceramic particles (such as aluminum oxide or aluminum nitride) and glass fibers. This composite structure maintains the dielectric strength and bonding properties of traditional materials while introducing high thermal conductivity through the ceramic particles, thereby reducing thermal resistance and improving heat radiation efficiency.
2Loss of energy
If power source lines operate in a balanced state, then power loss is uniform and temperature rise is low, but when some lines stop, the remaining lines experience increased power and temperature
Solution Approach 1:
The patent introduces a heat dissipation plate as an intermediary thermal management component. This plate is thermally coupled to the power devices and provides an additional heat dissipation path, acting as a mediator to distribute and dissipate heat more effectively when power devices operate under high load conditions, thereby preventing excessive temperature rise and maintaining system reliability.
3Adaptability or versatility
If cooling means is limited (ocean or outer space environment), then temperature control becomes difficult, but effective heat radiation is necessary to maintain reliability
Solution Approach 1:
The patent implements self-service thermal management by integrating heat dissipation structures directly into the multilayer substrate and power device assembly. The heat dissipation plate and improved insulation materials work passively to conduct and radiate heat away from power devices without requiring active cooling systems, enabling the system to maintain temperature control in environments where cooling means are limited or unavailable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance in multilayer substrates, preventing temperature rises in magnetic devices and enhancing the reliability of power source apparatuses by dispersing heat efficiently, even when only some power source lines operate.
Implementation Method 1
an insulation material to which first insulation particles each having a first particle diameter are added... reducing thermal resistance by improving insulation and fluidity, and allowing efficient heat radiation
Data Source
AI summary
The multilayer substrate according to the present disclosure includes: a plurality of substrates in which conductors are wired; and an insulation material to which first insulation particles each having a first particle diameter are added. The multilayer substrate has a lamination structure such that, in two of the substrates adjacent to each other among the plurality of substrates having been laminated, the first insulation particles, each having the first particle diameter substantially the same as the interval between the conductors on the two substrates, are disposed so as to be respectively brought into contact with the conductors wired on the adjacent two substrates.