Multilayer Wiring Substrate Layout for Uniform Transistor Heating

The patent applies asymmetry by intentionally creating non-uniform via-conductor distributions. Specifically, different densities and patterns of via-conductors are used in different regions of the substrate, with higher via-density in regions requiring greater heat dissipation and lower density in regions where temperature uniformity is already adequate. This asymmetric arrangement allows optimization of heat dissipation performance in critical areas without compromising overall temperature uniformity.

The patent implements local quality by varying the thermal conductivity characteristics in different regions of the substrate. Different via-conductor materials, sizes, and spacing are used to create region-specific thermal properties. For example, high-thermal-conductivity via-conductors are concentrated in high-power transistor regions, while lower-density via-conductors are used in low-power regions, thereby achieving locally optimized heat dissipation that maintains temperature uniformity across the entire device.

The patent applies segmentation by dividing the via-conductor structure into multiple functional groups: ground vias, power vias, signal vias, and thermal vias. Each segment serves a specific purpose in the overall heat dissipation and electrical connection system. This segmentation allows for independent optimization of each via-type without requiring complex interactions between all vias, thereby managing device complexity while achieving improved thermal conductivity.

The patent implements universality by designing via-conductors that serve multiple functions simultaneously. The same via-conductor structure provides both electrical connection (grounding, power supply, signal transmission) and thermal conduction. This multi-functionality reduces the need for separate dedicated thermal vias, thereby improving thermal conductivity without proportionally increasing device complexity.