Multilayer Substrate Design with Variable Resin Stack Positions
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer substrates lack flexibility in design due to fixed stack number and position of resin base materials, leading to suboptimal capacitance and increased stray capacitance, and require unnecessary high-accuracy materials and processes across the entire substrate, increasing manufacturing costs.
Innovation Solution
A multilayer substrate design where the stack number and position of resin base materials can vary between different portions, allowing for separate optimization of capacitance and reducing the number of connecting portions, using a combination of high-accuracy and low-accuracy materials and processes only where necessary, made from the same thermoplastic resin and bonded using hot pressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the stack number and position of resin base materials are fixed across the entire substrate, then manufacturing is simplified, but design flexibility is reduced and capacitance optimization is limited
Solution Approach 1:
The substrate is divided into multiple regions (first region, second region, third region) where each region can have different stack numbers and positions of resin base materials. This segmentation allows independent optimization of capacitance and stray capacitance in different areas while maintaining manufacturing simplicity through standardized regional modules.
Solution Approach 2:
Different regions of the substrate are assigned different structural characteristics: the first region has a first stack number and first position for optimal capacitance, the second region has a second stack number and second position for stray capacitance control, and the third region has a third stack number and third position for signal transmission. This local quality approach enables region-specific optimization without complicating overall manufacturing.
2Reliability
If the stack number is increased to optimize capacitance in one region, then capacitance increases, but stray capacitance increases and manufacturing cost increases
Solution Approach 1:
The first region uses a first stack number optimized for capacitance, while the second region uses a second stack number optimized for stray capacitance control. This local quality differentiation allows each region to achieve its electrical performance goals without compromising the other region's performance.
Solution Approach 2:
By segmenting the substrate into regions with different stack numbers, the patent isolates the high-capacitance area to where it is needed while maintaining low-stray-capacitance areas where signal integrity is critical. This segmentation prevents the harmful effect of stray capacitance from propagating across the entire substrate.
3Manufacturing precision
If high-accuracy materials and processes are used across the entire substrate, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies different manufacturing accuracy levels to different regions: high-accuracy materials and processes are used in the first region for optimal capacitance, while standard accuracy is sufficient for the second and third regions. This local quality approach reduces overall manufacturing cost while maintaining necessary precision where critical.
Solution Approach 2:
The substrate is segmented into regions with different precision requirements, allowing the manufacturing process to allocate resources efficiently. High-precision processes are applied only where electrical performance is most sensitive, while less critical areas use cost-effective manufacturing approaches.
4Reliability
If the stack number is increased to ensure connectivity, then connection reliability is improved, but the number of via conductors increases and conductivity decreases
Solution Approach 1:
The third region uses a third stack number specifically optimized for signal transmission with minimal via conductors. This local optimization ensures that connectivity-critical areas have the necessary connection reliability without unnecessarily increasing the via conductor count across the entire substrate, which would degrade overall conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances flexibility, reduces manufacturing costs by optimizing material and process usage, prevents unnecessary increases in stack number and conductivity issues, and ensures uniform physical properties, facilitating easier surface mounting and high-accuracy high-frequency filter circuit creation.
Implementation Method 1
a plurality of resin base materials made of a same thermoplastic resin are stacked and bonded by heating and pressurization
Implementation Method 2
a plurality of resin base materials made of a same thermoplastic resin are stacked and bonded by heating and pressurization
Implementation Method 3
a side surface and a bottom surface of the first substrate are welded to the second substrate
Implementation Method 4
made from the same thermoplastic resin and bonded using hot pressing
Data Source
AI summary
A multilayer substrate is manufactured by first manufacturing a first substrate by stacking and hot-pressing resin base materials of the first substrate and then adjacently stacking and hot-pressing the first substrate and resin base materials that constitute a second substrate at a position overlapping with each other in a stacking direction. The position in the stacking direction between the resin base materials in the first substrate is located at almost a middle position in the stacking direction of a resin base material of the second substrate, and is different from the position between the layers of the resin base materials of the second substrate.