Multilayer Substrate Via Conductor Composite Design
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Solution Overview
Problem
Conventional multilayer substrates with interlayer connection conductors have high conductor resistance and limited material selection, which affects bonding strength and conductivity.
Innovation Solution
The use of a combination of via conductors made from conductive paste and metal elements as interlayer connection conductors, connected through solid state diffusion bonding, to reduce conductor resistance and enhance bonding strength while maintaining bondability with external electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If material achieving bonding function is selected for interlayer connection conductor, then bondability with external electrode is maintained, but conductor resistance increases
Solution Approach 1:
The interlayer connection conductor is formed as a composite structure comprising a via conductor made of conductive paste and a metal element embedded within or surrounding the paste. This composite configuration allows the conductive paste to provide bonding function while the metal element provides low resistance, thereby resolving the contradiction between bondability and conductor resistance
Solution Approach 2:
The invention changes the material composition parameters of the interlayer connection conductor by incorporating metal elements (such as copper, aluminum, or silver) into the conductive paste matrix. This parameter change transforms the conductor from a single-material structure to a multi-material structure with optimized electrical and bonding properties
2Strength
If via conductors are connected in series to provide wiring, then bonding function is achieved, but conductor loss increases
Solution Approach 1:
By forming a composite interlayer connection conductor with metal elements embedded in conductive paste, the invention reduces the number of series-connected via conductors needed. The metal element provides a low-resistance path that spans multiple insulating layers, reducing total conductor loss while maintaining bonding strength through the paste component
3Strength
If multiple via conductors are used to provide wiring, then bonding is achieved, but manufacturing complexity increases
Solution Approach 1:
The invention merges the functions of multiple via conductors into a single interlayer connection conductor structure. The metal element can extend through multiple insulating layers continuously, eliminating the need for multiple discrete via conductors and their associated alignment and bonding processes, thereby simplifying manufacturing while maintaining bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces conductor loss and increases the reliability of electrical connections, while also simplifying the manufacturing process and reducing the number of required via conductors, leading to a multilayer substrate with improved mechanical strength and reduced transmission loss.
Implementation Method 1
The first interlayer connection conductor is a via conductor provided, for example, by filling conductive paste in a through hole provided in an insulating base material layer, and solidifying the conductive paste by a heating and pressing process
Data Source
AI summary
A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.