Multilayer Substrate Via-Conductor Segmentation for Flatness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer substrates face challenges in achieving both high heat dissipation and flatness due to differences in shrinkage between via-conductors and ceramic layers, leading to reduced heat flow and surface protrusions.
Innovation Solution
A heat dissipating unit is designed with via-conductors partially superposed in the stacking direction, featuring first and second communicating portions and a branching portion, where the central portions of adjacent via-conductors are separated to absorb deformation and maintain heat dissipation paths, integrated to reduce protrusions and enhance flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If via-conductors are formed smaller to improve flatness, then flatness of the substrate surface is improved, but heat dissipation characteristics deteriorate
Solution Approach 1:
The via-conductor structure is segmented into multiple portions (first via-conductor portion, second via-conductor portion, third via-conductor portion) with different diameters along the stacking direction. The first portion has a larger diameter for heat dissipation, the second portion has a smaller diameter for flatness, and the third portion has a larger diameter again for heat dissipation. This segmentation allows each portion to serve different functions simultaneously.
Solution Approach 2:
Different portions of the via-conductor have different local qualities (diameters) optimized for different requirements. The first and third portions have larger diameters optimized for heat dissipation, while the second portion has a smaller diameter optimized for surface flatness. This local quality variation resolves the contradiction between overall flatness and heat dissipation.
2Temperature
If via-conductors are superposed continuously from component contact position to enhance heat dissipation, then heat dissipation characteristics are improved, but flatness of the substrate surface deteriorates
Solution Approach 1:
The continuous via-conductor structure is segmented into multiple portions with varying diameters. This segmentation allows the via-conductor to maintain heat dissipation pathways while creating a stepped configuration that reduces surface protrusion and improves overall flatness.
Solution Approach 2:
The via-conductor structure transitions from a simple cylindrical form to a multi-dimensional stepped structure with varying diameters along the stacking direction. This dimensional variation allows the structure to occupy space efficiently, providing heat dissipation pathways while minimizing surface protrusion.
3Temperature
If via-conductors are formed with larger diameter to improve heat flow, then heat dissipation characteristics are improved, but flatness of the substrate surface deteriorates
Solution Approach 1:
The via-conductor is divided into segments with different diameters. The first and third portions have larger diameters to ensure adequate heat flow, while the second portion has a smaller diameter to reduce surface protrusion. This segmentation allows the structure to achieve both heat dissipation and flatness requirements.
Solution Approach 2:
Different local regions of the via-conductor have different diameters optimized for different functions. The lower and upper portions have larger diameters for heat dissipation, while the middle portion has a smaller diameter for flatness. This local quality differentiation resolves the contradiction between heat flow and flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high heat dissipation characteristics while maintaining high flatness, preventing temperature rises and ensuring electronic components are mounted parallelly without tilting.
Implementation Method 1
a plurality of via-conductors partially superposed on each other in the stacking direction... disposed continuously between the component connecting unit and the external connecting unit... heat dissipating unit
Implementation Method 2
During the manufacturing of the multilayer substrate, the via-conductors and the ceramic layers shrink, and due to a difference in the amount of shrinkage therebetween, the flatness of the surfaces of the substrate may be decreased
Data Source
AI summary
A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer. Where the via-conductors of the branching portion and the via-conductor of the communicating portion are adjacent to each other, the positions of the centers of the adjacent via-conductors are separated from each other as viewed from the stacking direction.