Multi-Layer Substrate Waveguide Design for RF Signal Transmission
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Solution Overview
Problem
The existing multi-layer substrates with waveguides suffer from increased transmission loss and poor signal transmission properties due to assembly and forming tolerances, especially when used in high-frequency RF signal applications like automobile radars, where precise manufacturing is crucial to maintain performance.
Innovation Solution
A multi-layer substrate design featuring through-holes with conductive films on the inner surfaces of the substrates, coupled using a soldering member, allows for precise waveguide formation and improved signal transmission by reducing assembly tolerances and enabling efficient RF signal transmission through the thickness direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a laminated waveguide is formed in the thickness direction of the substrate to transmit RF signals between different surfaces, then signal transmission between antenna pattern and RF circuit is enabled, but transmission loss increases due to reflection at direction change portions
Solution Approach 1:
The invention transitions the waveguide transmission path from the thickness direction (vertical dimension) to the plane direction (horizontal dimension) by forming the waveguide along the surface of the substrate. This dimensional change eliminates direction changes at substrate interfaces, thereby reducing reflection losses while maintaining signal transmission capability between antenna and RF circuit.
2Reliability
If the waveguide structure is precisely formed to reduce transmission loss for high-frequency RF signals, then signal transmission property improves, but manufacturing complexity and assembling tolerance requirements increase
Solution Approach 1:
The invention segments the waveguide formation process into standardized layers within the multi-layer substrate structure. Each layer is formed using conventional PCB manufacturing techniques with standard tolerances, and the overall waveguide geometry is achieved through the cumulative effect of these segmented layers, reducing the need for high-precision single-step formation.
Solution Approach 2:
The multi-layer substrate structure serves multiple functions: it provides mechanical support, electrical insulation, and waveguide formation simultaneously. The same lamination and etching processes used for standard PCB traces are also used to form the waveguide walls, eliminating the need for specialized high-precision manufacturing equipment or processes.
3Productivity
If high area density is achieved by increasing waveguide concentration, then signal transmission capability improves, but transmission path must change from plane direction to thickness direction increasing loss
Solution Approach 1:
The invention resolves the area density problem by utilizing the plane direction (horizontal dimension) rather than forcing transmission through the thickness direction (vertical dimension). Multiple waveguides can be arranged in parallel along the substrate surface, achieving high area density without requiring vertical penetration and associated direction changes that cause loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in stable and precise RF signal transmission performance, reducing signal loss and allowing for the use of substrates with varying sizes and shapes, while also enabling the transmission of various signals, including low-frequency signals, through the waveguide.
Implementation Method 1
a first waveguide which is connected to the first signal line and includes a first conductive film formed on an inner surface of a first through-hole passing through the first substrate base in a thickness direction
Implementation Method 2
coupling the upper substrate and the lower substrate by interposing a soldering member made of a metal material between the upper substrate and the lower substrate
Data Source
AI summary
The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.