Multilayer High-Temperature Superconducting Wire via Diffusion Joining
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for assembling high temperature superconducting wires with multiple layers face challenges such as high resistance, thermal stress, and increased thickness, which hinder efficient large current conduction and stability, particularly when forming additional superconducting layers.
Innovation Solution
A method involving a stacking process with diffusion joining of protective layers under atmospheric pressure, followed by exfoliation and outer protective layer formation, allows for the easy addition of multiple superconducting layers with reduced thickness and improved stability, using a substrate, buffer layers, and protective layers made of noble metals like silver.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple superconducting layers are assembled by soldering, then large current conduction capability is improved, but resistance between wires increases and superconducting performance deteriorates
Solution Approach 1:
A copper layer is introduced as an intermediary material between superconducting layers to replace traditional soldering. The copper layer provides excellent electrical conductivity and mechanical bonding, eliminating the high resistance and performance deterioration caused by soldering while maintaining strong inter-layer connections for large current conduction.
Solution Approach 2:
The invention replaces the mechanical soldering process with a diffusion bonding mechanism. By applying heat and pressure, copper atoms diffuse across the interface between superconducting layers, creating a metallurgical bond that eliminates interfacial resistance and maintains superconducting performance under mechanical and thermal stress.
2Power
If multiple superconducting layers are stacked to increase current capacity, then current conduction is improved, but thermal stress and separation due to thermal expansion differences occur
Solution Approach 1:
The invention changes the thermal and mechanical parameters of the layer structure by introducing a copper layer with intermediate thermal expansion properties between the superconducting layers. This parameter adjustment reduces the thermal stress differential during cooling, preventing layer separation and maintaining structural stability while preserving high current conduction capacity.
Solution Approach 2:
The invention creates a composite multi-layer structure consisting of superconducting layers and copper stabilizing layers. This composite structure combines the high critical current density of superconducting materials with the excellent thermal and mechanical properties of copper, achieving both high current capacity and thermal stress resistance.
3Ease of manufacture
If conventional assembly methods are used for multiple superconducting layers, then manufacturing is possible, but production time increases and cost increases
Solution Approach 1:
The copper stabilizing layer is prepared and positioned in advance before the final assembly of superconducting layers. This preliminary action allows for pre-formed bonding interfaces and reduces the complexity of the assembly process, enabling faster production while maintaining manufacturing feasibility through standardized preparation procedures.
Solution Approach 2:
The invention merges the stabilizing function and the bonding function into a single copper layer that serves both purposes. This consolidation eliminates the need for separate stabilizing and bonding operations, reducing production steps and time while maintaining ease of manufacture through a unified material selection.
4Power
If additional superconducting layers are added to increase current density, then current capacity is improved, but overall thickness increases
Solution Approach 1:
The invention employs thin-film superconducting layers deposited on flexible substrates, allowing multiple layers to be stacked with minimal thickness accumulation. The thin-film technology enables high current density in each layer while maintaining overall wire flexibility and reducing total thickness compared to bulk superconducting materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient formation of multiple superconducting layers with reduced AC loss, prevents separation due to thermal expansion differences, and simplifies the manufacturing process by allowing continuous production under atmospheric pressure, while maintaining high current density and mechanical properties.
Implementation Method 1
a joining process in which the protective layers facing each other are diffusion joining together by performing a thermal treatment on the pair of superconducting wires that are stacked
Implementation Method 2
A superconducting phenomenon is a physical phenomenon in which resistance of a substance reaches zero at a temperature below a critical temperature
Data Source
AI summary
Proposed is a high temperature superconducting wire manufacturing method and a high temperature superconducting wire having multiple superconducting layers formed by applying the method. The method includes a stacking process in which a pair of protective layers of superconducting wires including a substrate, a superconducting layer, and the protective layer are stacked such that the protective layers face each other, a joining process in which the protective layers facing each other are diffusion joining together by thermal treatment and become a joining protective layer, an exfoliating process in which a layered structure of an upper portion of the corresponding superconducting layer is removed such that one side of the superconducting layer is exposed to the outside, and an outermost protective layer forming process in which an outer protective layer formed of the same material as the joining protective layer is formed on the upper portion of the exposed superconducting layer.