Multi-layer Support Structure for Microelectronic Assembly

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The miniaturization of microelectronic assemblies poses challenges in reducing the size of support structures while preventing deformation that could harm the active region during bonding, as existing methods often result in excessive deformation and increased risk of damage.

Innovation Solution

A method involving a multi-layer support structure with planar sections of differing compositions, where adhesive layers are bonded to the device and lid with a structural layer in between to resist deformation under environmental conditions, allowing for closer proximity to the active region without risking damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the support structure is reduced in size to enable miniaturization, then the assembly size is reduced, but the support structure becomes more prone to deformation during bonding that could harm the active region

Engineering Contradiction:

Improveassembly sizeVSAvoiddeformation resistance

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The support structure is divided into multiple planar sections with different compositions. Each section can be optimized for specific functions: some sections provide structural support while others provide deformation resistance. This segmentation allows the support structure to maintain small overall size while incorporating specialized regions that prevent deformation during bonding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support structure employs planar sections with different compositions, creating a composite structure. This allows combining materials with different properties in a single support structure - some materials provide rigidity and structural support while others provide deformation resistance, enabling the small support structure to maintain both compact size and high reliability.

Inventive Principle:

Principle #40Composite materials

2Length of stationary object

If the support structure is positioned closer to the active region to reduce assembly size, then miniaturization is achieved, but the risk of deformation into the active region increases

Engineering Contradiction:

Improvedistance from active regionVSAvoiddeformation risk to active region

Core Design Contradiction:

Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

Different planar sections of the support structure have different compositions tailored to their specific locations and functions. Sections closer to the active region are designed with materials or structures that provide enhanced deformation resistance, while other sections may be optimized for different properties. This local quality optimization allows the support structure to be positioned close to the active region without increasing deformation risk.

Inventive Principle:

Principle #3Local quality

3Device complexity

If a single-layer support structure is used to simplify manufacturing, then device complexity is reduced, but the ability to resist deformation under bonding conditions is insufficient

Engineering Contradiction:

Improvesupport structure layersVSAvoiddeformation resistance

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The support structure is segmented into multiple planar sections with different compositions, where each section serves a specific functional purpose. This segmentation enables the structure to achieve superior deformation resistance through material diversity while maintaining manufacturing simplicity through a planar, multi-section design that can be fabricated using standard processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

By employing planar sections with different compositions, the support structure creates a composite material system that delivers enhanced deformation resistance. This composite approach allows optimization of each section's material properties for its specific function while maintaining overall structural integrity and manufacturing feasibility.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the likelihood of deformation into or over the active region, enabling smaller microelectronic assemblies with higher support structures without increased damage risk, facilitating the miniaturization of microelectronic devices.

Implementation Method 1

The support structure has planar sections that include first and second adhesive layers coupled to the device and to the lid, respectively

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

The structural layer is adapted to resist deformation under environmental conditions associated with bonding the first adhesive layer to the device and the second adhesive layer to the lid

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9548145B2Microelectronic assembly with multi-layer support structure

Publication Date: 2017.01.17 ADEIA SEMICON TECH LLC

AI summary

A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.