Multilayer Susceptor Heater Layout for Uniform Wafer Heating
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Solution Overview
Problem
Conventional ceramic susceptors suffer from non-uniform temperature distribution and defects such as cracks in the heater patterns due to oxidation, affecting the temperature uniformity and stability in semiconductor and display device manufacturing processes.
Innovation Solution
The susceptor features multilayer heater patterns with arcs arranged at different angles and non-overlapping straight sections to ensure even temperature distribution and reduce oxidation-related defects, using materials like tungsten and molybdenum for the heater and insulating plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the inner heater pattern and outer heater pattern are formed on the same plane in the same layer, then the structure is simple, but the temperature uniformity deteriorates
Solution Approach 1:
The patent transitions from a single-plane heater arrangement to a multi-layer vertical arrangement. The inner heater pattern and outer heater pattern are disposed on different planes (first plane and second plane respectively), utilizing the vertical dimension to achieve better temperature uniformity while maintaining structural simplicity.
2Area of stationary object
If the straight sections of the heater are spaced a small distance apart, then the heater coverage is improved, but oxidation defects increase
Solution Approach 1:
The patent resolves the contradiction between heater coverage and oxidation defects by moving straight sections to different vertical planes. The first straight section is on the first plane while the second straight section is on the second plane, allowing both sections to be closely spaced horizontally for better coverage while vertically separated to prevent oxidation defects.
3Manufacturing precision
If the heater patterns are arranged to improve temperature uniformity, then the temperature control precision is improved, but the device complexity increases
Solution Approach 1:
The patent achieves improved temperature control precision through a relatively simple multi-layer structure. By disposing heater patterns on two planes with specific angular relationships (45 degrees or 90 degrees between corresponding straight sections), the patent achieves better temperature uniformity without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves temperature uniformity across the susceptor surface, reduces defects, and enhances temperature control freedom, leading to more stable and precise semiconductor and display device manufacturing processes.
Implementation Method 1
the heater receives power and generates heat to heat the semiconductor wafer substrate
Data Source
AI summary
The present disclosure relates to a susceptor, and a susceptor of the present disclosure may improve temperature uniformity over the entire area of the upper surface of the susceptor by arranging a heater pattern of a multilayer structure so that arcs thereof do not overlap or so that the straight sections of the heater are arranged at different angles with respect to the center in different layers, or by arranging the straight sections of the heater at different angles with respect to the center even in a heater pattern of a single-layer structure.