Multilayer Adhesive Tape for EMI Shielding on Protrusion Electrodes
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Solution Overview
Problem
Existing adhesive tapes for semiconductor package manufacturing processes face challenges in effectively protecting the lower surface of semiconductor packages and protrusion electrodes during EMI shielding layer formation, due to issues with adhesion, retention, removal, and stress characteristics.
Innovation Solution
The adhesive tape comprises a first base film with a plastic or metal material, a first adhesive layer containing an acrylic-based copolymer, a second base film with a metal material, and a second adhesive layer with silicon having a spiral network structure, which provides excellent adhesion, retention, removal, and stress characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer adhesive tape is used for protecting the lower surface of semiconductor packages during EMI shielding, then the structure is simple, but the adhesion, retention, removal, and stress characteristics are insufficient
Solution Approach 1:
The adhesive tape is divided into multiple functional layers: a first adhesive layer for initial bonding, a second adhesive layer for enhanced adhesion and stress management, and optionally a release layer for controlled removal. This segmentation allows each layer to specialize in specific functions, improving overall reliability without requiring a completely complex new structure.
Solution Approach 2:
The tape uses composite material construction with different adhesive formulations in each layer. The first adhesive layer may use one polymer system while the second layer uses a different polymer system, creating a composite structure that combines the benefits of multiple materials to achieve superior adhesion, retention, and stress characteristics.
2Reliability
If the adhesive tape maintains strong adhesion during EMI shielding process, then protection is effective, but removal becomes difficult
Solution Approach 1:
The tape incorporates a release layer or release coating that is applied in advance to the adhesive surface. This preliminary action creates a controlled interface that prevents excessive bonding during the EMI shielding process, allowing for easy removal afterward while maintaining effective protection during use.
Solution Approach 2:
The adhesive system exhibits dynamic characteristics where the adhesion strength changes based on process conditions. The first adhesive layer provides strong initial bonding, while the second adhesive layer or release mechanism allows for controlled debonding during removal, creating a dynamic adhesion profile that adapts to different process stages.
3Ease of operation
If the adhesive tape is designed for easy removal, then operability is improved, but adhesion and protection during EMI shielding are compromised
Solution Approach 1:
The adhesive system is segmented into multiple layers with different functions. The first adhesive layer provides strong bonding for protection, while the second adhesive layer or release layer facilitates easy removal. This segmentation allows the system to exhibit both strong adhesion and easy removal characteristics simultaneously through its multi-layer architecture.
4Ease of manufacture
If the adhesive tape structure is simplified, then manufacturing is easier, but stress balance and air bubble prevention are insufficient
Solution Approach 1:
The adhesive tape utilizes thin film structures with flexible yet controlled mechanical properties. The multiple adhesive layers are designed as thin films that can conform to the substrate while maintaining stress balance. This approach achieves reliable stress management and defect prevention without requiring bulky or complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive tape effectively protects the lower surface of semiconductor packages and protrusion electrodes by maintaining stress balance, preventing air bubbles, and ensuring strong adhesion and easy removal, thereby enhancing the EMI shielding process.
Implementation Method 1
a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film
Implementation Method 2
a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film
Data Source
AI summary
The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.