Multilayer Thin Film for Ceramic Electronic Component
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Solution Overview
Problem
Current multilayer ceramic electronic components face challenges in increasing capacitance due to limited electrode surface area and electrode spacing, which hinders their miniaturization and capacity enhancement.
Innovation Solution
A multilayer thin film structure is developed with alternately formed ceramic and metal layers on a substrate, where the layers are charged with opposing polarities and have controlled thicknesses, allowing for increased surface area and reduced spacing between electrodes, utilizing materials like magnesium, calcium, strontium, and silver, to enhance capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the dielectric layer is thinned to increase the number of stacked layers, then the capacitance increases, but the manufacturing precision and reliability deteriorate
Solution Approach 1:
The patent changes the physical state and size parameters of the constituent elements by using nanoscale particles (metal oxide nanoparticles and metal nanoparticles) instead of conventional thick layers. This parameter change enables the formation of ultra-thin ceramic and metal layers with controlled thicknesses of a few hundred nanometers or less, thereby increasing the number of stacked layers and capacitance while maintaining manufacturing feasibility through solution-based processing
Solution Approach 2:
The patent applies local quality by using charged nanoparticles with specific surface properties that enable selective deposition. The metal oxide nanoparticles and metal nanoparticles are charged with opposite polarities, allowing them to be deposited alternately in a controlled manner. This local quality control at the nanoparticle level ensures uniform layer formation and precise thickness control, resolving the manufacturing precision issue associated with thinning dielectric layers
2Quantity of substance
If the electrode surface area is increased to enhance capacitance, then the capacitance increases, but the device size increases
Solution Approach 1:
The patent transitions from conventional two-dimensional planar electrodes to three-dimensional vertically stacked multilayer structure. By stacking numerous ultra-thin ceramic and metal layers alternately in the vertical dimension, the electrode surface area is dramatically increased without expanding the device footprint. This dimensional transition enables high capacitance in a compact form factor
Solution Approach 2:
The patent segments the electrode structure into multiple discrete thin layers separated by dielectric layers. Instead of using a single thick electrode, the electrode function is distributed across numerous thin metal layers (each with thickness controlled by nanoparticle size), increasing the total effective electrode surface area while maintaining a compact overall device size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach significantly increases the number of layers and decreases the distance between electrodes, resulting in ceramic electronic components with higher capacitance and improved reliability, while also offering economic efficiency in manufacturing.
Implementation Method 1
a first solution containing metal oxide nano particles charged with a charge; preparing a second solution containing metal nano particles charged with a charge having a polarity opposite to that of the charge of the metal oxide nano particles; alternately forming at least one ceramic layer and one metal layer on at least one of the upper and lower surfaces of the substrate by repeating an operation of alternately immersing the substrate charged with a charge in the first and second solutions
Data Source
AI summary
There are provided a multilayer thin film for a ceramic electronic component and a method of manufacturing the same. The multilayer thin film includes a substrate; and a ceramic layer and a metal layer alternately formed on at least one of upper and lower surfaces of the substrate, wherein at least one of the ceramic layer and the metal layer has a height corresponding to a thickness of at least one of a plurality of particles arranged on a plane. With the multilayer thin film for a ceramic electronic component, the number of layers increases and a distance between electrodes decreases, whereby capacitance may increase.