Multi-Layer Pattern Transfer Printing for Self-Aligned Conductive Lines
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Solution Overview
Problem
Existing methods for producing multi-layered features in electric circuits, such as photovoltaic solar cells and printed electronics, are inefficient and costly, often requiring separate processes for each layer and facing challenges like alignment and material compatibility.
Innovation Solution
A pattern transfer method using a pattern transfer sheet with multi-layered printing paste stacks, filled layer-by-layer and transferred onto a receiving substrate in a single illumination step, utilizing controlled parameters like blade pressure, angle, and flexibility to achieve self-aligned multi-layered features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate processes are used for each layer, then material compatibility and alignment can be controlled, but production time and cost increase significantly
Solution Approach 1:
The patent combines multiple separate layer deposition processes into a single pattern transfer printing process. Multiple layers of printing paste are deposited simultaneously onto the receiving substrate in one printing operation, eliminating the need for separate processes for each layer while maintaining alignment through the self-aligned nature of the pattern transfer method.
Solution Approach 2:
The pattern transfer sheet is pre-prepared with multiple layers of printing paste stacked in the correct sequence and alignment before the printing process. This preliminary preparation of the multi-layered structure on the transfer sheet allows for simultaneous transfer of all layers in a single step, reducing production time while ensuring proper alignment.
2Manufacturing precision
If separate processes are used for each layer, then alignment can be achieved, but production cost increases
Solution Approach 1:
The patent merges multiple separate printing processes into a single pattern transfer printing operation. By preparing multi-layered stacks of printing paste on the pattern transfer sheet before printing, all layers are transferred simultaneously in one step, reducing the number of process steps, equipment requirements, and operational costs while maintaining precise alignment.
Solution Approach 2:
The pattern transfer sheet acts as a master template that is copied onto the receiving substrate. The multi-layered structure on the transfer sheet is replicated in a single printing operation, eliminating the need for multiple separate printing processes and reducing overall manufacturing costs while ensuring consistent alignment.
3Productivity
If single illumination step is used, then production throughput increases, but control over each layer becomes more difficult
Solution Approach 1:
The pattern transfer sheet is pre-configured with multiple layers of printing paste in the correct sequence, thickness, and alignment before the printing process. This preliminary preparation ensures that each layer is properly positioned and controlled on the transfer sheet, allowing for simultaneous transfer of all layers in a single illumination step while maintaining precise layer control.
Solution Approach 2:
Different layers of printing paste on the pattern transfer sheet can have different local properties such as material composition, thickness, and paste formulation. This allows each layer to be optimized for its specific function while being transferred simultaneously in a single printing operation, maintaining both throughput and layer control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective, high-throughput production of multi-layered conductive lines and structures with improved material compatibility and alignment, reducing production time and costs while enhancing performance.
Implementation Method 1
radiating light towards the front surface of the source substrate, to remove at least one piece of the coating material from the source substrate and deposit said removed at least one piece onto the receiving substrate
Implementation Method 2
releasing, using a single illumination step, the stack from the trenches onto a receiving substrate through illumination by a laser beam
Data Source
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AI summary
Pattern transfer sheets and methods are provided, providing multi-layer paste stack lines that are printed on a receiving substrate in a single illumination step. The paste is filled layer-by-layer, possibly having different materials in different layers, with layer thickness controlled by parameters of the filling elements, e.g., in case of blades, the pressure, angle, velocity and flexibility (material) of the blade. Specifically, a bottom layer of the stack may be configured to interface the receiving substrate while one or more top layers may be configured to optimize the quality of the printed features. For example, bottom layers may comprise to bind to the substrate, to modify the substrate (e.g., forming selective emitter (SE) therein) and/or provide a barrier from top layer(s) which may not be compatible with the substrate (e.g., copper on silicon). Releasing material may be used to support the single step release of the stack line.