Multilayer Board Transformer Layout for Lower Wiring Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer board transformers used in power conversion devices face challenges with increased wiring inductance, which affects circuit operation, and larger board sizes, leading to higher costs.
Innovation Solution
A power conversion device design that includes a multilayer board with a transformer region and a circuit board, where the transformer coils have a larger number of turns, and the circuit coils have fewer turns, reducing wiring inductance and board size, and allowing for efficient power conversion while minimizing fabrication costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer board transformer is used with conventional coil configurations, then power conversion function is achieved, but wiring inductance increases adversely affecting circuit operation
Solution Approach 1:
The patent divides the transformer structure into distinct primary-side and secondary-side coil regions with different turn configurations. By segmenting the coil design and placing circuits directly on the multilayer board adjacent to specific coils, the patent reduces overall wiring inductance while maintaining power conversion functionality.
2Device complexity
If a multilayer board transformer is used, then integration is improved, but board size increases leading to higher costs
Solution Approach 1:
The patent merges the transformer structure with the circuit board by forming both the transformer coils and the conversion circuits on the same multilayer board. This integration eliminates the need for separate discrete components and reduces the overall board size while maintaining functional complexity.
3Reliability
If circuits are electrically connected to transformer coils via terminal portions, then electrical connection is achieved, but wiring inductance increases
Solution Approach 1:
The patent transitions from conventional two-dimensional terminal connection to a three-dimensional integrated structure where circuits are formed directly on the multilayer board adjacent to the transformer coils. This spatial reconfiguration reduces the length and inductance of electrical connections while maintaining reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses the adverse effects of wiring inductance on circuit operation, reduces board size, and lowers fabrication costs, while maintaining efficient power conversion and transmission efficiency.
Implementation Method 1
a transformer for insulating an input side (primary side) and an output side (secondary side) from each other is used
Data Source
AI summary
A power conversion device includes a multilayer board including conductive layers that form a primary-side coil and a secondary-side coil of a transformer; and a circuit board electrically connected to the multilayer board, having a first conversion circuit formed therein or thereon. The multilayer board includes a transformer region in which the transformer is formed; a core member disposed in the transformer region and around the primary-side coil and secondary-side coil are wound; a circuit formed region which is adjacent to the transformer region and a second conversion circuit is formed, the second conversion circuit being electrically connected to the primary-side coil or the secondary-side coil; and a terminal portion which is electrically connected to the secondary-side coil or the primary-side coil. The first conversion circuit is electrically connected to the transformer via the terminal portion. One of the coils has a smaller number of turns than the other coil.