Multilayer VCSEL Interconnects for Dense Structured Light Arrays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The complex electrical interconnection of large, addressable light emitter arrays, such as VCSELs, becomes challenging when VCSEL elements are interspersed among each other, limiting the density and layout of high-density illumination patterns required for applications like 3D imaging and sensing.
Innovation Solution
A multilayer conductor interconnect structure is employed, where each conductor layer is isolated by a dielectric layer, allowing conductors to cross over each other and be placed on top of one another, enabling flexible and complex connections to peripheral contact pads, thereby increasing interconnect density and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single layer of conductor patterns is used to connect VCSEL elements, then the fabrication process is simpler, but the interconnect density and flexibility are insufficient for high-density arrays with interspersed elements
Solution Approach 1:
The patent transitions from a two-dimensional single-layer conductor layout to a three-dimensional multilayer conductor structure. By stacking multiple conductor layers vertically with dielectric insulation between them, the system achieves higher interconnect density and routing flexibility while maintaining fabrication feasibility through standardized semiconductor manufacturing processes.
Solution Approach 2:
The patent implements nested conductor layers where multiple conductor patterns are stacked vertically within the same lateral footprint. Each conductor layer is embedded within dielectric layers, creating a nested structure that allows multiple independent electrical connections to occupy the same planar space, thereby increasing interconnect density without expanding the device area.
2Device complexity
If multiple conductor layers are stacked to increase interconnect density, then the connection flexibility for interspersed VCSELs improves, but the fabrication complexity increases
Solution Approach 1:
The patent segments the conductor interconnect function into multiple independent layers, each responsible for connecting specific subsets of VCSEL elements. This segmentation allows each layer to be optimized for particular routing requirements while simplifying the overall design by dividing the complex interconnection task into manageable discrete layers that can be fabricated using standard sequential deposition and patterning processes.
3Device complexity
If conductors are routed between interspersed VCSELs in a single layer, then the lateral routing flexibility is limited, but adding multiple layers increases the device area
Solution Approach 1:
The patent resolves the area-routing flexibility trade-off by moving conductor routing into the vertical dimension. Multiple conductor layers stacked vertically provide extensive routing flexibility for connecting interspersed VCSELs without requiring additional lateral space, as each layer utilizes the same footprint area through vertical stacking with dielectric insulation.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A multilayer interconnect is described which enables electrically connecting a complex distribution of VCSEL or other light emitter elements in a large high density addressable array. The arrays can include many groups of VCSEL elements interspersed among each other to form a structured array. Each group can be connected to a contact pad so that each group of light emitter elements can be activated separately.