Multilayer Electronic Component Via Layout for Continuity Inspection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inspection of dielectric layers without inductors in multilayer electronic components is difficult due to challenges in detecting positional deviations and continuity issues in via wiring lines.
Innovation Solution
A multilayer electronic component design with via wiring lines connecting inductors to side-surface electrodes, allowing for inspection of dielectric layers by checking electric continuity between terminals, and incorporating capacitors and inductors in specific sections to facilitate accurate defect detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If side-surface electrodes are used for electrical connection, then ease of operation is improved, but inspection capability deteriorates because dielectric layers without inductors cannot be inspected
Solution Approach 1:
The patent segments the electrical connection function by introducing separate via wiring lines that extend from the inductor to the first surface, distinct from the side-surface electrode connections. This segmentation allows independent inspection paths: the via wiring lines enable inspection of dielectric layers without inductors, while side-surface electrodes maintain ease of electrical connection.
2Measurement precision
If inductors are provided on dielectric layers for inspection, then measurement precision is improved, but device complexity increases due to additional components
Solution Approach 1:
The via wiring lines serve multiple functions: they provide electrical connection between the inductor and the first surface, and simultaneously serve as inspection paths for detecting positional deviations and defects in dielectric layers. This multi-functionality enables inspection capability without adding dedicated inspection components, thus avoiding increased device complexity.
3Reliability
If via wiring lines are extended to enable inspection, then reliability is improved through defect detection, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection function and the inspection function into the same via wiring lines. The via wiring lines that are necessary for electrical connection between the inductor and the first surface are simultaneously used as inspection paths, eliminating the need for separate inspection wiring and reducing overall device complexity.
Data Source
AI summary
A multilayer electronic component includes a multilayer structure that includes dielectric layers stacked in a stack direction and has first and second surfaces provided on respective sides in the stack direction, a first side-surface electrode provided on a side surface of the multilayer structure, an inductor provided in the multilayer structure, a capacitor provided between the inductor and the first surface, a via wiring line penetrating dielectric layers from a first dielectric layer, which is in contact with the inductor, to a second dielectric layer, which is located closer to the first surface than at least a part of the capacitor, and electrically connecting a first end of the inductor and the first side-surface electrode, and a second side-surface electrode electrically connected to the first side-surface electrode through the inductor and the via wiring line and provided on the side surface or another side surface of the multilayer structure.