Multilayer Electronic Component Via Conductor Stray Capacitance

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional multilayer electronic components with shield electrodes on side surfaces face challenges in minimizing stray capacitance between via conductors and shield electrodes, especially when the signal electrode area is small or close to the side surface, leading to deviations in filter characteristic design values.

Innovation Solution

The configuration of via conductors is optimized by dividing them into first and second via conductors, where the second via conductor is electrically coupled with the pattern conductor in a position further from the shield electrode, ensuring a larger distance and reducing stray capacitance, while the shield electrode is positioned on multiple side surfaces to minimize noise influence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the via conductor is formed within the area of a signal electrode to achieve compact design, then the device complexity is reduced, but the stray capacitance between the via conductor and shield electrode increases

Engineering Contradiction:

Improvevia conductor arrangementVSAvoidstray capacitance

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The via conductor is divided into two separate via conductors: a first via conductor that couples the pattern conductor to the signal electrode, and a second via conductor that couples the pattern conductor to the ground electrode. This segmentation allows each via conductor to be optimally positioned to minimize stray capacitance with the shield electrode while maintaining electrical coupling functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pattern conductor serves as an intermediary element between the via conductors and the electrodes. By routing connections through the pattern conductor, the design achieves compact arrangement while the via conductors can be positioned at optimal distances from the shield electrode, reducing stray capacitance effects.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the signal electrode area is made small to increase density, then the productivity is improved, but the stray capacitance between via conductor and shield electrode increases

Engineering Contradiction:

Improvemounting densityVSAvoidstray capacitance

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

Dividing the via conductor into first and second via conductors enables compact signal electrode design while positioning each via conductor to minimize stray capacitance. The segmented structure allows optimal spatial arrangement even with reduced electrode area.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pattern conductor extends in a direction away from the shield electrode, utilizing the third dimension (depth/length extension) to achieve electrical coupling while maintaining small surface area. This dimensional approach reduces stray capacitance by increasing distance from the shield electrode.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If the via conductor is positioned far from the shield electrode to reduce stray capacitance, then the stray capacitance decreases, but the device complexity increases

Engineering Contradiction:

Improvestray capacitanceVSAvoidvia conductor configuration

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The via conductor is segmented into first and second via conductors, allowing one via conductor to be positioned far from the shield electrode to reduce stray capacitance, while the other via conductor handles the remaining coupling function. This segmentation simplifies the overall configuration by distributing functions across multiple elements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pattern conductor serves multiple functions: it couples the via conductors to electrodes, extends away from the shield electrode to reduce stray capacitance, and provides structural support. This multi-functionality reduces device complexity by combining multiple roles into a single element.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS10242792B2Multilayer electronic component

Publication Date: 2019.03.26 MURATA MFG CO LTD

AI summary

A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is larger than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is larger than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.