Multilayer Electronic Component Via Conductor Stray Capacitance
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Solution Overview
Problem
Conventional multilayer electronic components with shield electrodes on side surfaces face challenges in increasing stray capacitance between via conductors and shield electrodes, especially when the signal electrode area is small or close to the side surface, limiting the design's ability to consider stray capacitance in filter characteristics.
Innovation Solution
The configuration of via conductors is optimized by dividing them into first and second via conductors, where the second via conductor is coupled with a pattern conductor closer to the shield electrode, ensuring a smaller distance and increased length to enhance stray capacitance, and the shield electrode is provided on multiple side surfaces to reduce noise influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the via conductor is formed within the area of a signal electrode, then the via conductor can be connected to the signal electrode, but the via conductor cannot be arranged sufficiently close to the shield electrode to increase stray capacitance
Solution Approach 1:
The via conductor is divided into a first via conductor and a second via conductor. The first via conductor connects the pattern conductor to the signal electrode within its area, while the second via conductor extends from the pattern conductor to a position closer to the shield electrode. This segmentation allows the via conductor system to achieve both electrical connection and increased stray capacitance.
Solution Approach 2:
The second via conductor is arranged to extend in a direction toward the shield electrode, utilizing the spatial dimension between the signal electrode area and the shield electrode. This dimensional arrangement allows the via conductor to achieve proximity to the shield electrode without conflicting with the signal electrode connection requirement.
2Area of stationary object
If the signal electrode area is small or the signal electrode is close to the side surface, then the component size is reduced, but the via conductor cannot be arranged sufficiently close to the shield electrode
Solution Approach 1:
By segmenting the via conductor into first and second via conductors, the invention decouples the connection function (first via conductor within signal electrode area) from the capacitance enhancement function (second via conductor extending toward shield electrode). This allows small signal electrodes to still achieve sufficient stray capacitance through the extended second via conductor.
Solution Approach 2:
The second via conductor utilizes the lateral dimension toward the shield electrode to increase stray capacitance, independent of the signal electrode area size. This dimensional approach allows even small signal electrodes to achieve the required stray capacitance by extending the via conductor path toward the shield electrode.
3Reliability
If the via conductor is positioned close to the shield electrode to increase stray capacitance, then stray capacitance is increased, but the via conductor may not be able to connect to the signal electrode within its area
Solution Approach 1:
The via conductor is segmented into two distinct parts with different positioning requirements. The first via conductor is positioned within the signal electrode area for reliable connection, while the second via conductor is positioned close to the shield electrode for capacitance enhancement. This segmentation resolves the positioning conflict by allowing each segment to be optimized for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases stray capacitance between via conductors and shield electrodes, allowing for better consideration in filter design and reducing noise interference, while also preventing solder wetting and ensuring high-density mounting.
Implementation Method 1
the stray capacitance between a via conductor that couples a pattern conductor provided in a multilayer body with a signal electrode provided on a bottom surface of the multilayer body, and a shield electrode provided near the via conductor
Data Source
AI summary
A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is smaller than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is smaller than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.