Multilayer Structure Warpage Measurement Using Optical Test Marks
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Solution Overview
Problem
Existing methods for measuring warpage in multilayer structures, such as those in electronic devices, are inefficient and prone to damage, lacking accuracy and precision.
Innovation Solution
A method involving the use of test marks with predetermined lengths disposed on layers, allowing for precise measurement of warpage by calculating the warping angle based on projected lengths using optical inspection, reducing manual measurement time and potential damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual thickness gauge measurement is used to measure warpage, then measurement can be performed, but measurement time is long and accuracy is insufficient
Solution Approach 1:
Test marks are pre-formed on the layers during the manufacturing process, establishing known reference positions and lengths before warpage occurs. This preliminary action enables direct calculation of warpage from projected length measurements without requiring complex manual measurement procedures during inspection.
Solution Approach 2:
The patent replaces manual mechanical thickness gauge measurement with an optical measurement system that captures images of test marks and calculates warpage through image processing. This substitution enables automated, high-precision measurement with significantly reduced measurement time.
2Reliability
If manual measurement methods are used, then warpage can be assessed, but the multilayer structure is prone to damage
Solution Approach 1:
The patent replaces contact-based mechanical measurement with non-contact optical imaging and image processing. This eliminates physical contact with the fragile multilayer structure, preventing damage while maintaining measurement reliability through precise digital analysis of test mark projections.
Solution Approach 2:
The measurement process creates a digital copy (image) of the test marks on the multilayer structure rather than physically interacting with the structure itself. This virtual copying approach allows repeated measurement without affecting the physical integrity of the sample.
3Measurement precision
If test marks are disposed on layers, then warpage measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The patent divides the measurement function into separate test marks formed on individual layers, allowing independent measurement of each layer's contribution to warpage. This segmentation simplifies the measurement approach by focusing on discrete reference features rather than attempting to measure the entire complex multilayer structure at once.
Solution Approach 2:
The patent changes the measurement parameter from direct physical thickness measurement to two-dimensional projected length measurement of test marks. This parameter transformation simplifies the measurement process while maintaining precision, as projected length can be accurately determined from simple optical images without complex three-dimensional measurement equipment.
Data Source
AI summary
A method for manufacturing a multi-layered structure on a supporting entity is provided. The method includes forming a first layer and a first test mark on the supporting entity, wherein the first test mark has a first predetermined length. The first projected length of the first test mark is measured in a top view. The first warpage degree of the first test mark is calculated according to the first predetermined length and the first projected length.