Multilayer Semiconductor Wiring for Inductive Current Sensing

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Solution Overview

Problem

Conventional semiconductor devices using resistive elements for current sensing face high power consumption due to Joule heat generation, which worsens with increasing current values, necessitating an improvement in device characteristics.

Innovation Solution

A semiconductor device incorporating a multilayer wiring structure with electrically isolated and magnetically connected inductors that detect electromotive voltage generated when current is supplied, allowing for accurate current sensing without the heat-related power consumption issues of resistive elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a resistive element is used for current sensing, then current detection can be achieved, but power consumption increases due to Joule heat generation

Engineering Contradiction:
Improvecurrent detection capabilityVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The patent replaces the resistive element (electrical measurement method) with an inductor-based electromagnetic induction system. Instead of measuring voltage drop across a resistor, the invention uses magnetic coupling between a first inductor and a second inductor to detect current through induced electromotive force, thereby eliminating Joule heat generation and reducing power consumption while maintaining current detection capability

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the detection parameter from voltage (resistive method) to electromotive force (inductive method). By utilizing electromagnetic induction principles, the system detects current through the induced voltage in the second inductor rather than through voltage drop measurement, fundamentally changing the measurement parameter to eliminate power consumption issues

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If current value increases, then current sensing capability is enhanced, but Joule heat generation and power consumption worsen

Engineering Contradiction:
Improvecurrent sensing accuracyVSAvoidJoule heat
Core Design Contradiction:
Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the resistive element (electrical measurement method) with an inductor-based electromagnetic induction system. Instead of measuring voltage drop across a resistor, the invention uses magnetic coupling between a first inductor and a second inductor to detect current through induced electromotive force, thereby eliminating Joule heat generation and reducing power consumption while maintaining current detection capability

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention converts the harmful effect of high current (which causes Joule heat in resistive sensors) into a beneficial electromagnetic field that induces electromotive force in the second inductor. The high current that previously caused heat generation is now utilized to create a stronger magnetic field for more accurate detection, transforming the harmful thermal effect into a useful electromagnetic signaling mechanism

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces power consumption and enhances the characteristics of semiconductor devices by utilizing inductors to detect current, minimizing Joule heat and improving detection accuracy.

Implementation Method 1

detecting an electromotive voltage generated in the inductor when the current is supplied within the wiring

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11901288B2Semiconductor device and method of manufacturing the same
Publication Date: 2024.02.13 RENESAS ELECTRONICS CORP
  • US11901288B2 patent drawing
  • US11901288B2 patent drawing
  • US11901288B2 patent drawing

AI summary

A semiconductor device includes a semiconductor substrate, a semiconductor element, and a multilayer wiring. The semiconductor element is formed on the semiconductor substrate. The multilayer wiring includes a wiring electrically connected with the semiconductor element, and a first inductor. The multilayer wiring is formed on the semiconductor substrate such that the multilayer wiring covers the semiconductor element. The first inductor is formed such that the first inductor electrically isolated from the wiring and is magnetically connected with the wiring.