Multilayer Wiring Board Layout for Low-Noise Length Matching

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Solution Overview

Problem

Conventional meander wires on wiring boards suffer from noise generation due to signal interference between adjacent wires, leading to degraded signal quality.

Innovation Solution

A wiring board design featuring a second wire with a path length equal to a first wire, where the second wire is formed with distinct portions on different layers and propagates signals in the same sense as the first wire, reducing noise interference by avoiding opposite signal propagation directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a meander wire is formed to equalize signal wire lengths, then signal timing synchronization is improved, but noise is generated due to mutual interference of signals between adjacent wires

Engineering Contradiction:
Improvesignal timing synchronizationVSAvoidnoise generation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies dimensionality change by transitioning from a planar meander wire layout to a three-dimensional stacked wire configuration. Multiple wire portions are arranged on different layers (first layer, second layer, third layer) of the substrate, utilizing the vertical dimension to achieve wire length equalization while avoiding adjacent wire interference that causes noise in conventional planar designs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the wire path into multiple discrete portions (first wire portion, second wire portion, third wire portion, fourth wire portion) that are distributed across different layers. This segmentation allows each wire portion to be independently routed on optimal layers, achieving both length equalization and noise reduction through strategic spatial separation.

Inventive Principle:
Principle #1Segmentation

2Object-generated harmful factors

If wire spacing is increased to reduce noise interference, then signal quality is improved, but board area increases

Engineering Contradiction:
Improvenoise interferenceVSAvoidboard area
Core Design Contradiction:
Object-generated harmful factorsVSArea of stationary object

Solution Approach 1:

By utilizing the vertical dimension through multi-layer wire portions, the patent reduces the need for increased horizontal spacing between wires. Wires that would traditionally require large lateral separation to avoid interference are instead stacked vertically, maintaining compact board layout while achieving noise reduction through layer separation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240397611A1Wiring board
Publication Date: 2024.11.28 MITSUBISHI ELECTRIC CORP
  • US20240397611A1 patent drawing
  • US20240397611A1 patent drawing
  • US20240397611A1 patent drawing

AI summary

A wiring board includes: a board; and a wire to connect a first point and a second point as one path, and propagate a signal from the first point to the second point. The wire has a first wire portion and a second wire portion that are arranged between the first point and the second point on the path through which the signal is propagated, and propagate the signal. The first wire portion propagates the signal in a first sense along a surface of the board, and the second wire portion is disposed in such a manner that, when seen in a direction perpendicular to the surface of the board, the second wire portion is adjacent to the first wire portion in a direction crossing a direction in which the signal is propagated, and propagates the signal in the first sense.