Multilayer Wiring Structure for Dense Signal Routing
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Solution Overview
Problem
Existing wiring structures in electronic devices face challenges in accommodating increased wire density and electrical requirements in a compact space, necessitating a new design to enhance device density and structural integrity.
Innovation Solution
A wiring structure comprising two distinct wiring patterns in different layers, interconnected by bridge wires and contact structures, forming a mesh pattern region that allows for efficient signal transmission and reduced area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of wires is increased to satisfy electrical requirements for higher resolution and quality, then the electrical performance is improved, but the area occupied by wires increases, reducing device density
Solution Approach 1:
The patent implements a multi-layer wiring structure where wires are arranged in different layers (first wiring pattern in one layer, second wiring pattern in another layer). This vertical stacking allows more wires to be packed into a compact horizontal area by utilizing the third dimension (depth/layer), thereby increasing wire density without proportionally increasing the planar area occupied by wires
Solution Approach 2:
The patent employs bridge wires that connect and overlap between different wiring patterns and layers. These bridge wires act as interconnectors that nest within the overall wiring structure, allowing signals to transition between layers while maintaining compact routing. The overlapping arrangement of bridge wires with input/output wires enables efficient space utilization
2Area of stationary object
If wires are arranged in a compact space to increase device density, then the area is reduced, but the structural integrity and signal transmission quality may deteriorate
Solution Approach 1:
By transitioning to a multi-layer architecture, the patent achieves compact horizontal spacing while maintaining adequate vertical separation between wiring patterns through insulating layers. This vertical stratification allows dense packing without compromising signal integrity, as wires in different layers do not physically interfere with each other
Solution Approach 2:
The patent introduces insulating layers as intermediary structures between the first and second wiring patterns. These insulating layers provide electrical isolation and mechanical support, enabling compact wire arrangement while preventing signal interference and maintaining structural integrity. The bridge wires also act as intermediaries for controlled signal transitions between layers
3Area of stationary object
If the width of the wiring structure is reduced to narrow the border area, then the device density is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the wiring structure into distinct segments: first wiring pattern, second wiring pattern, bridge wires, and insulating layers. This segmentation allows each component to be independently designed and manufactured, simplifying the overall fabrication process despite the compact dimensions. The modular approach enables systematic routing and connection strategies
Data Source
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AI summary
The present disclosure includes an electronic device including a wiring structure (101), the wiring structure (101) includes a first wiring pattern (110) including a plurality of first input wires (111) and a plurality of first output wires (112), a second wiring pattern (120) including a plurality of second bridge wires (123), one second bridge wire (120) crosses at least one of the plurality of first input wires (111) or at least one of the plurality of first output wires (112), and a first insulating layer (201) disposed between the first wiring pattern (110) and the second wiring pattern (120), the plurality of first input wires (111) are electrically connected to the first output wires (112) through the second bridge wires (123).