Multilayer Wiring Substrate Castellation Structure
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Solution Overview
Problem
Existing stack structure sensor packages face limitations in manufacturing flexibility, high disposal costs due to failure during production, and limited connection strength, especially when soldered to organic substrates, which hinders miniaturization and reuse of sensor components.
Innovation Solution
A multilayer wiring substrate with through holes and castellation structured electrical connection terminals on its edges and surfaces, allowing for improved connection strength and flexibility in sensor component reuse, and enabling the integration of additional functions without increasing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the stack-up manufacturing process is used where the integrated circuit is joined after the cavity is formed, then the manufacturing process is simple, but the manufacturing location is limited and disposal cost is high when failure occurs
Solution Approach 1:
The substrate is divided into a first substrate and a second substrate that are joined together. The first substrate includes a first surface and a second surface, while the second substrate includes a first surface and a second surface. This segmentation allows the sensor component to be mounted on the first substrate and the integrated circuit to be mounted on the second substrate, enabling separate manufacturing processes and increasing manufacturing flexibility.
Solution Approach 2:
The invention transitions from a single-substrate stack-up process to a multi-substrate assembly process. By adding the dimension of multiple substrates joined together, the manufacturing process becomes more flexible and can be performed at different locations. The first substrate and second substrate can be manufactured separately and then joined, allowing for distributed manufacturing.
2Strength
If the sensor component is soldered to an organic substrate with limited joint area, then the assembly is compact, but the connection strength is insufficient
Solution Approach 1:
The invention transitions from a two-dimensional joint area on the bottom surface to a three-dimensional connection structure using through-holes. The through-holes extend vertically through the substrate, allowing electrical connection terminals to be formed on the inner walls of the through-holes. This adds a vertical dimension to the connection area, significantly increasing the total joint area and improving connection strength.
Solution Approach 2:
The invention applies different connection structures to different locations: electrical connection terminals are formed on the inner walls of through-holes for vertical connections, while pad electrodes are formed on the bottom surface for horizontal connections. This localized differentiation optimizes the connection strength at each location based on the specific requirements.
3Adaptability or versatility
If additional components are placed outside the package to realize additional functions, then the functionality is enhanced, but the package size increases contradicting miniaturization
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support, electrical connections through pad electrodes and electrical connection terminals, signal routing through wiring patterns, and mounting surfaces for the sensor component and integrated circuit. By making the substrate multi-functional, additional features can be integrated without increasing package size.
Solution Approach 2:
The invention utilizes the vertical dimension within the package by forming through-holes that extend through the substrate thickness. This allows electrical connection terminals to be formed on the inner walls of the through-holes, providing additional connection points without increasing the horizontal package footprint, thus enabling miniaturization while maintaining functionality.
Data Source
AI summary
A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.