Multilayer Wiring Substrate With Deformable Conductive Paths
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Solution Overview
Problem
Conventional methods for connecting electronic components to wiring substrates, such as wire bonding, fail to provide sufficient connection stability due to weak compression bonding forces, leading to deterioration in conduction reliability and insulating properties.
Innovation Solution
A multilayer wiring substrate configuration featuring an anisotropic conductive member with an inorganic insulating base, conductive paths penetrating the base, and a pressure-sensitive adhesive layer, where conductive paths deform to contact electrodes and maintain electrical independence, preventing electrical connection between non-contacting paths to ensure reliable conduction and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If compression bonding force is increased to improve bonding strength between conductive paths and electrodes, then bonding strength is improved, but conductive paths collapse and adjacent paths become electrically connected causing loss of insulating properties
Solution Approach 1:
The patent employs a resin layer with controlled thickness and material properties that acts as a flexible constraint on the conductive paths. This resin layer allows the paths to deform and bond to electrodes under compression while preventing excessive collapse that would cause adjacent paths to touch and lose insulation. The resin layer's mechanical properties are specifically designed to balance bonding support with insulating protection.
Solution Approach 2:
The patent changes physical parameters including the thickness of the resin layer, the compression bonding force applied, and the material composition of the resin. By optimizing these parameters, the system achieves a state where conductive paths can sufficiently deform to bond with electrodes while maintaining enough structural integrity to prevent collapse and maintain electrical insulation between adjacent paths.
2Ease of manufacture
If conventional wire bonding methods are used to connect electronic components, then manufacturing simplicity is maintained, but connection stability is insufficient leading to deterioration in conduction reliability
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a compression bonding system using an anisotropic conductive film. Instead of mechanically manipulating individual wires to create connections, the system uses a film with conductive paths that deform under compression to establish electrical connections with electrodes, simplifying the manufacturing process while improving connection stability.
Solution Approach 2:
The patent changes the fundamental bonding mechanism from mechanical wire manipulation to compression-induced deformation of conductive paths within a film. By controlling parameters such as compression force, film thickness, and path geometry, the system achieves reliable connections without the complexity of traditional wire bonding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves excellent conduction reliability by ensuring reliable bonding of conductive paths with electrodes while maintaining insulating properties, preventing electrical connection between non-contacting paths and thus enhancing the stability and performance of electronic connections.
Implementation Method 1
a pressure sensitive adhesive layer which is provided on a surface of the insulating base
Implementation Method 2
conductive paths which come into contact with the electrode among the plurality of conductive paths are deformed and adjacent conductive paths come into contact with each other
Data Source
AI summary
Provided is a multilayer wiring substrate capable of achieving excellent conduction reliability. The multilayer wiring substrate is formed by laminating an anisotropic conductive member including an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each conductive path has a protrusion protruding from the surface of the insulating base, and a wiring substrate having a substrate and one or more electrodes to be formed on the substrate, and conductive paths which come into contact with the electrode among the plurality of conductive paths are deformed so that adjacent conductive paths come into contact with each other.