Multilayer Wiring Substrate Via Conductor Design
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Solution Overview
Problem
The existing multilayer ceramic substrates used in high-frequency switch modules often experience level differences on their surfaces due to the thickness of outer electrodes, leading to potential mounting failures such as solder wetting issues and misalignment of electronic components.
Innovation Solution
The multilayer wiring substrate design includes connection terminals arranged in an overlapping relation to rear electrodes on the surface, ensuring even heights and reduced risk of mounting failures, with in-plane conductors and thicker rear electrodes enhancing connection strength and reducing parasitic inductances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If outer electrodes are formed on the multilayer substrate to connect external circuit substrates, then electrical connection capability is improved, but level difference (step difference) occurs on the surface causing mounting failures
Solution Approach 1:
The patent introduces a via conductor extending from the first principal surface through the multilayer body to the second principal surface, adding a vertical dimension solution. This allows electrical connection while maintaining surface flatness by routing connections through the thickness of the substrate rather than adding height on the surface.
Solution Approach 2:
The patent introduces an insulating layer filled in the via conductor region as an intermediary element. This insulating layer mediates between the need for electrical connection (via conductor) and the need for surface flatness (insulating fill), allowing the via conductor to be present while maintaining a flat first principal surface.
2Measurement precision
If connection terminals are positioned on raised regions overlapping with rear electrodes, then mounting alignment is improved, but solder wetting may fail due to level differences
Solution Approach 1:
The patent positions connection terminals on the first principal surface at locations that are not affected by the level difference caused by rear electrodes. The insulating layer filled in via conductor regions creates equipotential surface regions where connection terminals can be reliably mounted without solder wetting issues, ensuring uniform mounting conditions across the surface.
3Strength
If rear electrodes are made thicker to increase connection strength, then electrical connection strength is improved, but level difference and mounting difficulty increase
Solution Approach 1:
The patent extracts the electrical connection function from the surface-level rear electrode structure and relocates it to via conductors extending through the multilayer body. This allows rear electrodes to maintain their connection strength function while removing the source of level differences that complicate mounting, separating the two functions into different spatial locations.
Data Source
AI summary
A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.