Multi-Layered Circuit Board for High-Speed Cable Connector Crosstalk Reduction
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Solution Overview
Problem
Existing cable assemblies face difficulties in high-speed data transfer due to narrow pitch pads for soldering connection wires, leading to defective products and crosstalk issues between conductive traces on the upper and lower surfaces of micro USB connectors.
Innovation Solution
A cable assembly design featuring a plug connector with a grounding metal piece between conductive terminals, a shielding shell, and a circuit board with larger rear-side pads for easier soldering and reduced crosstalk, where the first middle conductive layer connects front-side and rear-side power pads and includes a capacitor to shield high-frequency noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If narrow pitch pads are used on the circuit board to match the conductive terminals, then the connector can be compact and integrated, but the soldering process becomes very difficult and defective products increase
Solution Approach 1:
The circuit board is divided into two distinct pad regions: front-side pads with narrow pitch for connecting to conductive terminals, and rear-side pads with wide pitch for soldering connection wires. This segmentation allows each region to be optimized for its specific function, resolving the contradiction between compact size and ease of soldering.
Solution Approach 2:
The invention transitions from a single-plane pad arrangement to a multi-layered three-dimensional structure. Front-side pads are positioned on one surface while rear-side pads are positioned on the opposite surface, connected through conductive traces and vias. This dimensional change allows wide pitch pads for easy soldering while maintaining compact overall connector size.
2Volume of moving object
If conductive traces are placed close together on the circuit board, then the connector remains compact, but crosstalk occurs between traces during high speed data transfer
Solution Approach 1:
The invention separates differential signal pairs onto different layers of the multi-layered circuit board. By routing signals in the Z-direction through vias and using conductive traces on opposite surfaces, the design increases spatial separation between traces while maintaining compact footprint, thereby reducing crosstalk during high-speed data transfer.
Solution Approach 2:
Grounding and shielding structures are introduced as intermediary elements between signal traces. These ground planes and shielding layers act as barriers that prevent electromagnetic interference and crosstalk between adjacent conductive traces, enabling high-speed data transfer in the compact connector design.
3Adaptability or versatility
If multiple connection wires are soldered to the rear of the circuit board, then all conductive terminals can be connected, but the narrow pitch pads make the soldering process difficult and time-consuming
Solution Approach 1:
The circuit board is segmented into front-side pads for terminal connections and rear-side pads for wire connections. The rear-side pads are specifically designed with wide pitch and larger soldering areas, making them much easier and faster to solder compared to traditional narrow pitch pads, thereby improving productivity while maintaining full connection capability.
Solution Approach 2:
The invention utilizes the multi-layered structure to position soldering pads on the rear surface of the circuit board, away from the front-side terminal connections. This spatial separation allows workers to access and solder rear-side pads more easily without interference from front-side components, significantly improving soldering efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the soldering process, reduces defective products, and effectively prevents crosstalk during high-speed data transfer by increasing the pitch between rear-side pads and providing shielding against high-frequency noise.
Implementation Method 1
at least provided with a capacitor electrically connected between the first common grounding area and the common power area, so that the first common grounding area and the common power area can shield a high frequency noise
Implementation Method 2
the first common grounding area and the common power area can shield a high frequency noise
Data Source
AI summary
A cable assembly comprises a male connector plug, a circuit board and a cable. The circuit board has a first surface conductive layer and a second surface conductive layer that each include a plurality of front side pads and a plurality of rear side pads. The front side pads comprise four front side power pads soldered to four power terminals. The rear side pads comprise one rear side power pad and a soldering area of the rear side power pad is larger than a soldering area of the front side power pad. The circuit board is further at least provided with a first middle conductive layer positioned between the first surface conductive layer and the second surface conductive layer and a plurality of vias extending between layers.