Multilayered Electromagnetic Assembly Heat Dissipation
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Solution Overview
Problem
Micro-electromagnets and micro-solenoids face challenges with heat mitigation, as internal heat generated during operation can lead to overheating and potential damage, especially in miniaturized devices where cooling is inefficient and external cooling methods are not effective.
Innovation Solution
A multilayered electromagnetic assembly with planar substrate layers featuring cutaway portions, insulated electrically conductive material in a spiral configuration, and integrated heat conducting layers that allow for sequential electrical current passage and efficient heat dissipation through separate heat conducting portions to external surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If micro-electromagnets and micro-solenoids are miniaturized, then device size is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The device is divided into multiple planar substrate layers stacked together, with each layer containing spiral configurations. This segmentation allows heat to be distributed across multiple layers and dissipated through multiple external surfaces, improving heat dissipation efficiency while maintaining miniaturization.
Solution Approach 2:
The invention transitions from a single-layer planar structure to a multilayer stacked structure, utilizing the vertical dimension (z-axis) for heat dissipation. Heat can escape through multiple external surfaces of the stacked layers, effectively adding a dimensional pathway for thermal management without increasing the device footprint.
2Temperature
If external cooling methods are applied, then heat mitigation is improved, but device complexity increases
Solution Approach 1:
The multilayer electromagnetic assembly is designed to dissipate heat through its own structure - the stacked layers with cutaway portions and spiral configurations inherently provide multiple pathways for heat to reach external surfaces. The device serves its own cooling needs through its geometric design without requiring external cooling systems.
Solution Approach 2:
The invention extracts the cooling function from external systems and integrates it directly into the device structure itself. The multilayer configuration with cutaway portions and spiral configurations inherently creates heat dissipation pathways, removing the need for separate external cooling components.
3Temperature
If heat conducting layers are integrated into substrate layers, then heat conduction is improved, but manufacturing complexity increases
Solution Approach 1:
The heat conducting layers are merged with the substrate layers to form integrated planar structures. Each planar substrate layer incorporates heat conducting portions that are structurally combined with the substrate, allowing heat to conduct through the substrate layers themselves while maintaining a unified manufacturing process for each layer.
Solution Approach 2:
The planar substrate layers serve multiple functions simultaneously: they provide structural support, carry the spiral configurations for electromagnetic function, and include integrated heat conducting portions for thermal management. This multi-functionality reduces the need for separate components and simplifies manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively generates strong magnetic fields while preventing overheating by directing heat away from the substrate layers, enabling a low-profile, modular, or integrated design that maintains functionality without external cooling.
Implementation Method 1
an electrical current may be passed sequentially through the two or more spiral configurations, thereby generating a magnetic field in the core
Implementation Method 2
any internal heat generated within the electromagnetic assembly being conducted through the one or more heat conducting layers and out to at least one external surface
Data Source
AI summary
A multilayered electromagnetic assembly. The assembly has a plurality of substantially planar substrate layers, each substrate layer having a cutaway portion. An insulated electrically conductive material is provided, arranged in a spiral configuration on at least two of the substrate layers. The spiral configuration is formed from adjacent the cutaway portion to the edges of the substrate layer. The electrically conductive material is formed substantially on and/or partially recessed or beneath the surface of the substrate layer. The spiral configurations have first and second electrical contacts that are operable to pass electric current to electrical contacts of spiral configurations on other substrate layers. A ferromagnetic core is located through the cutaway portions of the substrate layers. The substrate layers are stacked and an electrical current is passed sequentially through the two or more spiral configurations, thereby generating a magnetic field in the core.