Multilayered Resistor Capacitor Construction via Polymer Adhesion
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Solution Overview
Problem
Conventional capacitors on printed circuit boards face limitations due to limited minimum thickness of dielectric material, leading to flexibility issues, low capacitance, poor dielectric strength, and the formation of microscopic voids or foreign material inclusions, which result in electrical shorts.
Innovation Solution
A method involving the use of thermosetting polymer layers and heat-resistant films to form multilayered constructions with embedded capacitors and resistors, where the polymer layers act as adhesives, enhancing precision, uniformity, and reducing manufacturing costs by attaching layers directly to the heat-resistant film rather than the conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single sheet of dielectric material is laminated with two conductive foils, then the capacitor structure is simple, but the dielectric layer is vulnerable to voids and foreign material inclusions causing electrical shorts
Solution Approach 1:
The single dielectric layer is segmented into multiple thin dielectric layers (first dielectric layer and second dielectric layer) separated by a heat-resistant film layer. This segmentation reduces the thickness of each individual dielectric layer, minimizing the formation of voids and foreign material inclusions, thereby preventing electrical shorts while maintaining structural simplicity.
Solution Approach 2:
A heat-resistant film layer is introduced as an intermediary between the two dielectric layers. This intermediate layer acts as a barrier that prevents direct contact between conductive foils through voids in the dielectric material, thereby preventing electrical shorts. The heat-resistant film also provides structural support during the lamination process.
2Quantity of substance
If the dielectric layer thickness is reduced to increase capacitance, then the capacitance increases, but the dielectric layer becomes more vulnerable to voids and foreign material
Solution Approach 1:
The total dielectric thickness is segmented into multiple thinner layers. Each thin dielectric layer has reduced thickness compared to a single thick layer, which increases the overall capacitance (C ∝ d/ε) while minimizing the probability of voids and foreign material inclusions in each layer, thereby maintaining reliability.
Solution Approach 2:
The heat-resistant film layer serves as an intermediary that allows the use of extremely thin dielectric layers without compromising reliability. By providing structural support and preventing direct foil contact, the intermediary layer enables the dielectric thickness to be reduced to increase capacitance while maintaining void-free construction.
3Ease of manufacture
If layers are attached in sequential order, then the manufacturing process is straightforward, but precision and uniformity are compromised
Solution Approach 1:
Multiple layers (first dielectric layer, heat-resistant film layer, second dielectric layer) are merged into a single laminated construction attached to the conductive foils simultaneously. This merging approach maintains the straightforward lamination process while achieving superior precision and uniformity, as the entire multilayer structure is bonded in one operation rather than sequentially.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in capacitors with higher capacitance, greater heat conductivity, and flexibility, while minimizing electrical shorts and improving manufacturing efficiency, leading to enhanced performance and cost-effectiveness.
Implementation Method 1
a first thermosetting polymer layer is attached onto a surface of a first electrically conductive layer; a second thermosetting polymer layer is attached onto a first surface of the heat resistant film
Implementation Method 2
the polymer layers act as adhesives, enhancing precision, uniformity, and reducing manufacturing costs by attaching layers directly to the heat-resistant film
Data Source
AI summary
The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.