Multilayered Substrate Reinforcing Layers Warpage Control
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Solution Overview
Problem
Multilayered substrates experience warpage due to varying coefficients of thermal expansion of embedded electronic components, limiting the integration of wiring patterns and mechanical strength, and existing solutions with high-rigidity insulating layers restrict pattern density and pitch.
Innovation Solution
Incorporating reinforcing layers with a coefficient of thermal expansion of 11 ppm/°C or less and an elastic modulus of 25 GPa or more, made of glass material, at the outermost surfaces of the substrate, along with optimized circuit pattern layers and insulating layers to reduce warpage and enhance integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a material having high rigidity is used to form the insulating layer, then the warpage of the substrate is decreased, but the surface of the insulating layer becomes rough, limiting the degree of integration of wiring patterns
Solution Approach 1:
The insulating layer is divided into multiple layers: a lower insulating layer made of high-rigidity material for warpage control, and an upper insulating layer made of low-rigidity material for smooth surface formation. This segmentation allows each layer to fulfill its specific function without compromising the other.
Solution Approach 2:
Different regions of the insulating structure use different materials with different properties. The lower insulating layer uses high-rigidity material where structural support is needed, while the upper insulating layer uses low-rigidity material where surface quality is needed, creating local optimization of properties.
2Volume of moving object
If the substrate is thinned to embed small electronic components, then miniaturization is achieved, but the warpage phenomenon becomes intensified
Solution Approach 1:
Reinforcing layers are added at the outermost surfaces of the substrate to counterbalance the warpage tendency caused by thinning. These reinforcing layers act as counterweights that compensate for the reduced structural stability, allowing the substrate to remain thin while maintaining flatness.
Solution Approach 2:
The substrate structure uses composite materials with different rigidity and thermal expansion properties. The combination of thin substrate material with reinforcing layers creates a composite structure that achieves both miniaturization and warpage control through the synergistic effects of the different materials.
3Adaptability or versatility
If electronic components are embedded in the substrate, then functionality is improved, but the warpage phenomenon is intensified due to different coefficients of thermal expansion
Solution Approach 1:
The reinforcing layers serve multiple functions: they control warpage caused by thermal expansion differences, provide mechanical strength to the thinned substrate, and enable fine pattern formation on their smooth surfaces. This multi-functionality addresses multiple problems simultaneously.
Solution Approach 2:
The invention changes the physical parameters of the substrate structure by adding reinforcing layers with specific rigidity and thermal expansion properties. This parameter change compensates for the adverse thermal expansion effects of embedded components, maintaining dimensional stability across different temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases warpage while improving the integration of wiring patterns, allowing for higher manufacturing efficiency and finer pattern densities without compromising mechanical strength.
Implementation Method 1
the warpage phenomenon is also called warpage. As the electronic component embedded substrate has been made of various materials having different coefficients of thermal expansion, the warpage of the substrate has been intensified
Implementation Method 2
The reinforcing layers may be made of a material having an elastic modulus of 25 GPa or more
Data Source
AI summary
A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component.