Multilayered Substrate Warpage Reduction via Segmented Insulating Layers
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Solution Overview
Problem
Multilayered substrates face challenges in reducing warpage and improving circuit pattern integration due to differences in thermal expansion coefficients and surface roughness of materials used in insulating layers, which limits the refinement of wiring patterns and increases the risk of substrate bending.
Innovation Solution
A multilayered substrate configuration featuring a second insulating layer with a fine pattern layer and a third insulating layer with a circuit pattern layer, where the third layer is positioned closer to the surface and made with a material like pre-preg containing glass fibers to reduce warpage, while the second layer is made of polyimide or Ajinomoto build-up film with fillers to control surface roughness and pattern pitch, allowing for direct connections between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If an insulating layer is formed of a material having strong rigidity to decrease warpage, then warpage is reduced, but the surface of the insulating layer becomes rough, limiting the degree of integration of wiring patterns
Solution Approach 1:
The patent divides the insulating layer into multiple sub-layers: a first insulating layer with strong rigidity for warpage reduction and a second insulating layer with smooth surface for fine wiring pattern integration. This segmentation allows each sub-layer to specialize in one function, resolving the contradiction between warpage reduction and wiring pattern integration.
Solution Approach 2:
The patent uses composite insulating layers combining materials with different properties. The first insulating layer uses materials with high rigidity (such as those containing glass fibers) to reduce warpage, while the second insulating layer uses materials with smooth surfaces to enable fine wiring patterns. This composite approach allows simultaneous achievement of both warpage reduction and high wiring integration.
2Length of moving object
If the electronic component embedded substrate becomes thinner to achieve miniaturization, then device size is reduced, but bending phenomenon (warpage) intensifies
Solution Approach 1:
The patent segments the substrate structure into multiple layers with different functional characteristics. The first insulating layer provides structural stability and warpage reduction, while the second insulating layer enables fine wiring. This segmentation allows the substrate to maintain thin overall thickness while the first layer compensates for warpage tendencies.
Solution Approach 2:
The patent applies local quality by giving different regions of the substrate different properties. The first insulating layer (particularly at the bottom) has enhanced rigidity to counteract warpage, while the second insulating layer has smooth surface properties for wiring. This localized differentiation allows thin substrate overall while maintaining stability where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively decreases warpage and enhances circuit integration by allowing for finer pattern pitches and line widths, improving the connection of electronic components and reducing substrate bending, while maintaining sufficient rigidity and surface smoothness for precise pattern formation.
Implementation Method 1
as the electronic component embedded substrate is configured of various materials having different thermal expansion coefficients, the warpage has intensified
Implementation Method 2
the second insulating layer may have surface roughness smaller than that of the third insulating layer
Implementation Method 3
The third insulating layer may include a core material made of a material including a glass fiber
Data Source
AI summary
Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer, thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring.