Multilayered Support Base Thermal Management via Carbon Nanotubes
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Solution Overview
Problem
Current thermal control systems in aerospace and industrial applications face inefficiencies due to temperature gradients and complex interconnections, leading to performance degradation and reliability issues in maintaining stable operating temperatures for components like satellites and spacecraft.
Innovation Solution
A multilayered support base with structural and function support sections, incorporating carbon nanotubes for enhanced thermal conductivity, power distribution, and signal transmission, which integrates heat dissipating and control components directly within the base, reducing external connections and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal paths with multiple interfacing materials are used, then thermal control can be achieved, but temperature gradient increases and thermal efficiency decreases
Solution Approach 1:
The patent combines multiple interfacing materials (RTV, heat pipe, flanges, face sheet) into a single integrated thermal path structure, eliminating the temperature gradients that occur at each interface and improving overall thermal efficiency
Solution Approach 2:
The patent uses composite thermal path materials that integrate the thermal conduction properties of different materials (RTV, heat pipe, flanges) into a unified structure, achieving superior thermal performance compared to sequential material interfaces
2Adaptability or versatility
If custom-tailored components are designed for specific missions, then functional performance is optimized, but device complexity and manufacturing effort increase
Solution Approach 1:
The patent develops universal base designs and standardized components that can be adapted to multiple missions and payloads, reducing the need for custom-tailored designs while maintaining functional performance through modular configurations
Solution Approach 2:
The patent segments the satellite system into standardized base components and modular payload interfaces, allowing different mission requirements to be met through configuration rather than complete redesign
3Adaptability or versatility
If multiple connectors and interconnections are used to integrate subsystems, then functional connections are achieved, but reliability decreases and performance degradation occurs
Solution Approach 1:
The patent merges multiple separate connectors and interconnections into integrated connection structures, eliminating the reliability losses and performance degradation associated with multiple discrete interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal control and dissipation efficiency, reduces performance degradation, and increases reliability by minimizing external connections and leveraging nanotechnology for superior conductivity and strength, applicable to various industrial and aerospace applications.
Implementation Method 1
carbon nanotubes for enhanced thermal conductivity
Data Source
AI summary
An apparatus may have a multilayered support base having a structural section made up of operating components and a function support section. The function support section may have transmission paths and components to supply thermal, power transmission, information and communication paths, along with other functions. At least some of the components may be heat generating and may have a thermal interface surface which may be in operating and heat conductive relationship with a heat conductive substrate/routing section which may have operative connections to the multilayered support base. Some of the components may transmit and receive with one another through the substrate/routing section.