Multilayered Tape Laser-Debondable Layer
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Solution Overview
Problem
Current methods for debonding adhesive bonded assemblies, especially those with strong adhesives or large bonded areas, often damage the substrates, lacking a universally accepted solution for debond-on-demand applications in fields like electronics, automotive, and medical devices.
Innovation Solution
A multilayered tape comprising a blowing agent-containing adhesive layer, a laser-translucent adhesive layer, and a laser-debondable layer with materials like metals, metal oxides, or radiation-curable lacquers, allowing for debonding without damaging the substrates through controlled expansion or laser activation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If strong adhesives are used to achieve high bonding strength, then the bonding strength between tape and substrate is improved, but the ease of debonding deteriorates
Solution Approach 1:
The adhesive system is segmented into multiple functional layers: a strong adhesive layer for bonding and a separate laser-debondable layer containing laser-sensitive materials. This segmentation allows the adhesive to provide high bonding strength while the debondable layer enables easy separation through laser activation, resolving the contradiction between strong bonding and easy debonding.
Solution Approach 2:
A laser-debondable intermediate layer is introduced between the strong adhesive and the substrate. This intermediary layer contains laser-sensitive materials that absorb laser energy and facilitate debonding when exposed to laser radiation, allowing the strong adhesive to maintain bonding strength while enabling controlled debonding on demand.
2Strength
If large bonded areas are used to improve coverage and adhesion, then the bonding strength is improved, but the difficulty of debonding increases
Solution Approach 1:
The laser-debondable intermediate layer acts as a mediator across the entire bonded area, providing a uniform debonding mechanism. When laser radiation is applied, the laser-sensitive materials throughout the large bonded area respond uniformly, enabling debonding of large areas without increasing complexity or difficulty.
Solution Approach 2:
The mechanical debonding process is replaced with a laser-based system. Instead of applying mechanical force to separate large bonded areas, laser radiation is used to activate the debondable layer, substituting a complex mechanical separation process with a simpler, more controlled laser activation process.
3Ease of operation
If conventional debonding methods are used to separate bonded assemblies, then separation is achieved, but substrate damage occurs
Solution Approach 1:
The laser-debondable intermediate layer serves as a protective intermediary that absorbs the energy required for debonding. The laser-sensitive materials in this layer undergo chemical or physical changes when exposed to laser radiation, facilitating separation while the laser energy is consumed by the intermediate layer rather than being transmitted to and damaging the substrate.
Solution Approach 2:
The laser energy that could potentially damage the substrate is converted into a beneficial effect by the laser-sensitive materials in the intermediate layer. These materials absorb the laser energy and convert it into a debonding mechanism, such as gas generation, melting, or chemical reaction, that separates the assembly without harming the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy separation of the multilayered tape from adhesively bonded adherents at a high bonding strength level, maintaining substrate integrity and facilitating residue removal, with debonding achieved through thermal or laser-induced expansion and oxidation of the laser-debondable layer.
Implementation Method 1
debonding achieved through thermal or laser-induced expansion
Implementation Method 2
debonding achieved through thermal or laser-induced expansion and oxidation of the laser-debondable layer
Implementation Method 3
debonding achieved through thermal or laser-induced expansion and oxidation of the laser-debondable layer
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present invention relates to a multilayered tape, comprising at least a layer sequence: (a1) a blowing agent-containing adhesive layer; (bi) a laser-translucent adhesive layer; (c) a laser-debondable layer comprising a laser-sensitive material selected from the group consisting of a metal, a metal oxide, carbon black and a radiation-curable lacquer; and (b2) a laser-translucent adhesive layer. Further, the present invention relates to the process for debonding said multilayered tape. Furthermore, the present invention relates to the use of said multilayered tape in electronic devices, automotive devices, medical devices and dentistry devices.