Multi-lens Frame Optical Module for CMOS Axis Alignment
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Solution Overview
Problem
Current optical image capturing modules with multiple lenses face challenges in accurately aligning the optical axis with CMOS active pixel sensors, leading to compromised image quality, and struggle with packaging complexity and height reduction.
Innovation Solution
An optical image capturing module design featuring a circuit assembly with image sensor elements, circuit substrates, conductive lines, and a multi-lens frame, where auto-focus lens assemblies are positioned to overlap the optical axis of the image sensor, allowing light to pass through and be emitted effectively, with driving assemblies for precise alignment and movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple lenses are used to meet higher photographic requirements, then imaging capability is improved, but optical axis alignment precision deteriorates
Solution Approach 1:
The patent divides the optical system into multiple independent lens modules, each with its own optical axis alignment mechanism. This segmentation allows each lens to be calibrated separately, ensuring that adding more lenses does not compromise the alignment precision of individual optical paths.
Solution Approach 2:
The patent implements preliminary optical axis calibration during the assembly process, establishing precise alignment before final assembly. This preliminary action ensures that when multiple lenses are integrated, each maintains accurate optical axis alignment with the CMOS sensor, preventing degradation of alignment precision.
2Adaptability or versatility
If more lenses and components are added to enhance imaging function, then adaptability is improved, but packaging complexity increases
Solution Approach 1:
The patent merges multiple lens modules and their support structures into an integrated assembly that shares common mounting interfaces and alignment references. This merging reduces the number of separate packaging operations and simplifies the overall assembly process, counteracting the complexity increase from adding more lenses.
Solution Approach 2:
The patent designs universal mounting structures and alignment mechanisms that can accommodate multiple lens types and configurations. This multi-functionality allows the same packaging framework to support enhanced imaging functions without requiring separate complex packaging solutions for each lens addition.
3Ease of manufacture
If conventional packaging technologies are used, then manufacturing is simplified, but module height cannot be reduced
Solution Approach 1:
The patent transitions from conventional horizontal stacking of lens modules to a vertical integration approach, arranging optical components along the optical axis direction. This dimensional change enables height reduction while maintaining manufacturing simplicity by using standardized vertical mounting procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures high image quality by accurately aligning the optical axis with the image sensor, simplifies packaging, and reduces the overall module height while maintaining precise control over lens movement.
Implementation Method 1
Each of the at least two auto-focus lens assemblies has at least two lenses with refractive power
Data Source
AI summary
An optical imaging module including a circuit assembly and a lens assembly is provided. The circuit assembly includes holding base, two circuit substrates, image sensor elements, conductive lines, and a multi-lens frame. The image sensor elements are disposed on the holding base. The circuit substrates are disposed on the carrier and surround the image sensor elements. The conductive lines are disposed between the circuit contacts of the circuit substrates and image contacts of the image sensor elements. The multi-lens frame is integrally formed and covered on the circuit substrate and the image sensor elements. The lens assembly may include lens base, two auto lens assemblies, and two drive assemblies. The lens bases can be disposed on the multi-lens frame. The auto lens assembly may have at least two lenses having refractive power. The driving assembly can be electrically connected to the circuit substrate.