Multilevel Driver Circuit for Pin-Efficient Chip-to-Chip Links

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current high-speed chip-to-chip communication systems face challenges in achieving high bandwidth, low latency, and low power consumption while maintaining resilience against noise and crosstalk, particularly in multi-chip systems where signal integrity and efficiency are critical.

Innovation Solution

The implementation of a multilevel driver circuit using vector signaling codes, such as the H4 and 5b6w codes, which transmit data over multiple wires with adjustable voltage levels, combined with multiphase processing and FIR filtering to ensure efficient data transmission and skew compensation, optimizing signal levels and impedance matching for improved pin efficiency and power utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If multilevel driver circuit with vector signaling codes is implemented, then pin efficiency and power consumption are improved, but device complexity increases

Engineering Contradiction:
Improvepower consumptionVSAvoiddevice complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by transitioning from traditional binary signaling (2 voltage levels) to multilevel signaling (4 or more voltage levels). This allows more bits to be transmitted per symbol period, improving power efficiency and pin utilization. The driver circuit generates multiple discrete voltage levels (e.g., +V, 0, -V/2, -V) to encode 2 bits per symbol, reducing the number of symbols needed and thus lowering power consumption compared to binary signaling.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent segments the signaling process into multiple phases (e.g., four phases) where each phase transmits a portion of the data. This segmentation allows the system to achieve high bandwidth while maintaining control over complexity through structured, modular processing. Each phase can be independently managed, and the overall system benefits from parallel processing capabilities.

Inventive Principle:
Principle #1Segmentation

2Productivity

If multilevel driver circuit with vector signaling codes is implemented, then pin efficiency is improved, but device complexity increases

Engineering Contradiction:
Improvepin efficiencyVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent changes the signaling parameter from binary (2 levels) to quaternary or higher (4+ levels), enabling 2 or more bits to be transmitted per wire per symbol period. This significantly improves pin efficiency as fewer physical pins are needed for the same data throughput. The driver circuit is designed to generate these multiple voltage levels using controlled switching of current sources.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements a universal multilevel driver architecture that can support different vector signaling codes (e.g., H4 code, 5b6w code) and different numbers of signaling levels. This multi-functional design allows the same hardware platform to be configured for various pin-efficient signaling schemes, making the solution adaptable to different bandwidth and power requirements while managing complexity through standardization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If multiphase processing with FIR filtering is used, then noise resilience and skew compensation are improved, but device complexity increases

Engineering Contradiction:
Improvenoise resilienceVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action through transmit-side pre-emphasis filtering using FIR (Finite Impulse Response) filters. This pre-processing compensates for anticipated channel effects such as intersymbol interference and noise before the signal is transmitted. By pre-shaping the signal, the system improves noise resilience and skew tolerance at the receiver without requiring complex equalization, thus managing overall system complexity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent incorporates feedback mechanisms where the receiver detects signaling errors, skew, and noise levels, and this information is fed back to the transmitter. The transmitter uses this feedback to adjust its signaling parameters, pre-emphasis levels, and timing. This closed-loop control improves reliability by dynamically adapting to channel conditions while keeping the base complexity manageable through intelligent control.

Inventive Principle:
Principle #23Feedback

4Speed

If higher voltage levels are used for signaling, then bandwidth and speed are improved, but power consumption increases

Engineering Contradiction:
Improvedata transmission speedVSAvoidpower consumption
Core Design Contradiction:
SpeedVSUse of energy by moving object

Solution Approach 1:

The patent changes the energy parameter by using asymmetric voltage levels (e.g., +V, 0, -V/2, -V) rather than symmetric levels. This allows the signal to achieve the necessary voltage swing for high-speed transmission while minimizing the average power consumption. The larger voltage swings occur less frequently, and the smaller swings handle more common transitions, optimizing the trade-off between speed and power.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses periodic multilevel signaling where data is transmitted in structured symbol periods with defined voltage level sequences. This periodic structure allows the system to achieve high effective bandwidth through efficient encoding schemes (like H4 or 5b6w codes) while controlling power consumption by managing the frequency and amplitude of voltage transitions. The rhythmic nature of the signaling optimizes both speed and energy efficiency.

Inventive Principle:
Principle #19Periodic action

Data Source

PatentUS10404500B2Multilevel driver for high speed chip-to-chip communications
Publication Date: 2019.09.03 KANDOU LABS SA
  • US10404500B2 patent drawing
  • US10404500B2 patent drawing
  • US10404500B2 patent drawing

AI summary

A plurality of driver slice circuits arranged in parallel having a plurality of driver slice outputs, each driver slice circuit having a digital driver input and a driver slice output, each driver slice circuit configured to generate a signal level determined by the digital driver input, and a common output node connected to the plurality of driver slice outputs and a wire of a multi-wire bus, the multi-wire bus having a characteristic transmission impedance matched to an output impedance of the plurality of driver slice circuits arranged in parallel, each driver slice circuit of the plurality of driver slice circuits having an individual output impedance that is greater than the characteristic transmission impedance of the wire of the multi-wire bus.