Multilevel Package Substrate Resolving FCBGA Tolerance and PCB Compatibility
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Solution Overview
Problem
Flip-chip ball grid array (FCBGA) package designs face limitations in accommodating advanced circuit designs due to feature size tolerance issues, and existing printed circuit board (PCB) layouts are not compatible with flip-chip chip scale packages (FCCSP) types, restricting their electrical performance and solder joint reliability.
Innovation Solution
A multilevel package substrate with patterned conductive features and molded dielectric features, including a first and second level with conductive trace layers and via layers, and conductive landing areas and pads, allowing for electrical coupling of a die to the substrate and attachment of solder balls, which facilitates compatibility with existing PCB layouts and enhances electronic device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If FCBGA package designs are used, then electrical performance and solder joint reliability are improved, but feature size tolerance limitations prevent accommodation of advanced circuit designs
Solution Approach 1:
The patent transitions from a single-plane PCB layout to a multilevel package substrate with conductive features distributed across multiple levels (first level with landing areas, second level with landing pads). This dimensional expansion allows advanced circuit designs to be accommodated while maintaining compatibility with FCBGA packaging, resolving the contradiction between reliability and manufacturing precision constraints.
2Reliability
If FCBGA package designs are used, then electrical performance is improved, but existing PCB layouts are not compatible
Solution Approach 1:
The multilevel package substrate is designed to serve multiple functions: it maintains compatibility with existing PCB layouts through its conductive feature configuration while simultaneously supporting advanced circuit designs and FCBGA packaging. The substrate acts as a universal interface that bridges legacy PCB designs with modern high-performance packaging requirements.
3Reliability
If advanced circuit designs are implemented, then electronic device performance is enhanced, but compatibility with existing PCB layouts is lost
Solution Approach 1:
The patent segments the circuit design into two distinct domains: the multilevel package substrate contains the advanced circuit designs with complex conductive feature arrangements, while the existing PCB layout remains unchanged. The substrate acts as an intermediary that encapsulates the advanced circuitry, allowing performance enhancement without requiring modifications to legacy PCB designs.
Data Source
AI summary
An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas and the second level having a second side with conductive landing pads. The electronic device includes a die with conductive terminals electrically coupled to respective ones of the landing areas, as well as solder balls attached to respective ones of the landing pads, and a package structure that encloses the die and a portion of the multilevel package substrate.