Multi-Material Fiber Layout for Reliable Embedded Device Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multi-material fibers used in textiles are limited in their ability to withstand mechanical and environmental stresses such as bending, stretching, and machine washing, and the incorporation of semiconductor devices during preform fabrication restricts control over device location and density within the fibers, leading to lower yields and reduced reliability.
Innovation Solution
A method of manufacturing multi-material fibers involves positioning electrically-connectable devices and conductors within a preform material, forming metallurgical bonds during the drawing process, and overcoating with a thermoplastic elastomer to enhance mechanical stability and reliability, with conductors located along the neutral axis to minimize stress exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor devices are incorporated during preform fabrication, then multi-material fibers can be produced with functional devices, but control over device location and density is restricted
Solution Approach 1:
The preform is divided into distinct regions: device pockets for housing semiconductor devices and separate conduits for electrical conductors. This segmentation allows independent positioning and control of devices and conductors, improving location precision while maintaining a manageable fabrication process.
Solution Approach 2:
The patent introduces intermediate structures (pockets and conduits) that mediate between the preform fabrication stage and the final fiber structure. These intermediaries provide controlled environments for device placement and conductor routing, enabling better location control without excessive process complexity.
2Strength
If conventional thermoplastics and cross-sectional architectures are used, then manufacturing is simplified, but fibers cannot withstand mechanical and environmental stresses
Solution Approach 1:
The patent employs composite material architecture combining thermoplastic matrix with embedded semiconductor devices, electrical conductors, and protective coatings. This composite structure enhances mechanical strength and environmental resistance while maintaining manufacturability through integrated preform fabrication.
Solution Approach 2:
Different regions of the fiber cross-section are assigned different properties: device pockets provide protective encapsulation, conduits provide mechanical support for conductors, and the thermoplastic matrix provides overall structural integrity. This local differentiation of material properties enhances overall strength without complicating the global manufacturing process.
3Reliability
If electrical conductors are positioned away from the neutral axis, then electrical connection is achieved, but conductors are exposed to higher stress during bending
Solution Approach 1:
The patent introduces conduits as intermediary structures that house electrical conductors. These conduits are positioned to protect conductors from direct mechanical stress while maintaining electrical connection functionality, acting as a buffer between the conductor and the external bending forces.
Solution Approach 2:
The conduit structures serve as flexible protective shells that accommodate conductor positioning. These shells can deform with the fiber during bending while maintaining conductor integrity and electrical connection, reducing stress exposure on the conductors themselves.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in more robust multi-material fibers that can withstand typical textile use cases, including bending and washing, with improved reliability and increased device density, enhancing their survivability and functionality.
Implementation Method 1
drawing the multi-material fiber by causing the preform material to flow, such that the first electrical conductor extends within the multi-material fiber along a longitudinal axis thereof
Implementation Method 2
overcoating the drawn multi-material fiber with a thermoplastic elastomer material
Implementation Method 3
at least one of (i) a metallurgical bond is formed between the first electrical conductor and the first electrode while drawing the multi-material fiber
Data Source
Figure 1A~1B
Figure 2
Figure 3~4
AI summary
Methods of manufacturing multi-material fibers having one or more electrically-connectable devices disposed therein are described. In certain instances, the methods include the steps of: positioning the electrically-connectable device(s) within a corresponding pocket provided in a preform material; positioning a first electrical conductor longitudinally within a first conduit provided in the preform material; and drawing the multi-material fiber by causing the preform material to flow, such that the first electrical conductor extends within the multi-material fiber along a longitudinal axis thereof and makes an electrical contact with a first electrode located on each electrically-connectable device. A metallurgical bond may be formed between the first electrical conductor and the first electrode while drawing the multi-material fiber and/or, after drawing the multi-material fiber, the first electrical conductor may be located substantially along a neutral axis of the multi-material fiber.