Multi-Material Fiber Layout for Durable Embedded Electrical Connections
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Solution Overview
Problem
Conventional multi-material fibers are limited in their ability to withstand mechanical and environmental stresses, such as bending, stretching, and machine washing, due to limitations in control over semiconductor device placement and density within textiles, leading to reduced reliability and survivability in typical textile use cases.
Innovation Solution
A method of manufacturing multi-material fibers involves positioning electrically-connectable devices and conductors within a preform material, forming metallurgical bonds during the drawing process, and locating these connections along the neutral axis to enhance mechanical stability and durability, while also incorporating additional fibers for added strength and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor devices are incorporated into preform material, then multi-material fibers with functional devices are produced, but control over device location and density is limited
Solution Approach 1:
The preform material is segmented into distinct regions: device pockets for semiconductor devices, conduits for electrical conductors, and connection zones where metallurgical bonding occurs. This segmentation enables precise control over device location and conductor positioning, resolving the contradiction between adaptability and manufacturing precision.
Solution Approach 2:
Semiconductor devices, electrical conductors, and connection structures are pre-positioned within the preform material before fiber drawing. This preliminary action ensures precise device location control and enables high device density, as components are arranged in their final positions during preform fabrication rather than during the drawing process.
2Reliability
If conventional multi-material fibers are used, then textile manufacturing is simplified, but reliability under mechanical stress is reduced
Solution Approach 1:
The fiber employs a composite structure with a preform material matrix, embedded semiconductor devices, metallurgical bonds, and protective cladding. This composite architecture enhances reliability under mechanical stress by distributing loads across multiple materials with complementary properties, while the integrated design maintains manufacturing feasibility.
Solution Approach 2:
Different regions of the fiber exhibit specialized properties: device pockets provide mechanical support and positioning, conduits protect electrical conductors, and connection zones are optimized for metallurgical bonding. This local quality enhancement improves overall fiber reliability without requiring complex global structural changes.
3Strength
If electrical conductors are positioned away from neutral axis, then electrical connection is achieved, but mechanical stability under bending is reduced
Solution Approach 1:
The preform material acts as an intermediary that positions electrical conductors along the neutral axis during fiber drawing. The metallurgical bond formed between conductors and device electrodes within the preform structure maintains electrical connection reliability while the neutral axis positioning ensures mechanical stability under bending stresses.
4Quantity of substance
If device density is increased, then functional capability is enhanced, but manufacturing control becomes more difficult
Solution Approach 1:
The preform material is divided into multiple discrete device pockets arranged in a controlled pattern, enabling high device density while maintaining precise manufacturing control. Each pocket is independently defined with specific dimensions and spacing, allowing systematic placement of numerous semiconductor devices without compromising manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in multi-material fibers that are more robust and capable of surviving the rigors of textile use, with improved mechanical stability and reliability, enabling their successful integration into garments and textiles for functional applications.
Implementation Method 1
a metallurgical bond may be formed between the first electrical conductor and the first electrode while drawing the multi-material fiber
Data Source
AI summary
Methods of manufacturing multi-material fibers having one or more electrically-connectable devices disposed therein are described. In certain instances, the methods include the steps of: positioning the electrically-connectable device(s) within a corresponding pocket provided in a preform material; positioning a first electrical conductor longitudinally within a first conduit provided in the preform material; and drawing the multi-material fiber by causing the preform material to flow, such that the first electrical conductor extends within the multi-material fiber along a longitudinal axis thereof and makes an electrical contact with a first electrode located on each electrically-connectable device. A metallurgical bond may be formed between the first electrical conductor and the first electrode while drawing the multi-material fiber and/or, after drawing the multi-material fiber, the first electrical conductor may be located substantially along a neutral axis of the multi-material fiber.